Abstract: Epoxy adhesive compositions are provided. Specifically, the composition is a two-part, low-heat cure epoxy structural adhesive composition with a unique, well-balanced array of properties. The composition comprises components (A) and (B) where component (A) comprises at least one compound having an average epoxy functionality of at least two and optionally an epoxy functionalized liquid rubber and where component (B) comprises a polyamine, a polyamide and optionally an epoxy reactive liquid rubber. The compositions are useful as structural adhesives in bonding operations in industrial manufacturing such as automobile manufacturing.