Abstract: Embodiments of the disclosure provide cooling systems and cooling methods for isolating temperature fluctuation in an electronics enclosure. Embodiments of the disclosure provide effective cooling of high power temperature fluctuating components and a stable reference temperature for temperature sensitive components included in a single electronics enclosure. A disclosed multiple path cooling system includes a first path for cooling power variable components and a second path to maintain stable temperature cooling for temperature sensitive components.

Abstract: An apparatus for guidance and retention of integrated circuit boards includes a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate. The apparatus further includes a second structure configured to be removably coupled to the first structure. The second structure includes a first spring member configured to apply a first compressive force to the first integrated circuit board.