Abstract: Various embodiments of the present invention are directed to photonic interconnects that can be used for on-chip as well as off-chip communications between computer system components. In one embodiment of the present invention, a photonic interconnect comprises a plurality of on-chip waveguides. Additionally, the photonic interconnect may include a plurality of off-chip waveguides, and at least one optoelectronic converter. The at least one optoelectronic converter can be photonically coupled to a portion of the plurality of on-chip waveguides, can be photonically coupled to a portion of the plurality of off-chip waveguides, and is in electronic communication with at least one computer system component.

Abstract: Various embodiments of the present invention are directed to stacked memory modules. In one embodiment of the present invention, a memory module comprises at least one memory-controller layer stacked with at least one memory layer. Fine pitched through vias (e.g., through silicon vias) extend approximately perpendicular to a surface of the at least one memory controller through the stack providing electronic communication between the at least one memory controller and the at least one memory layers. Additionally, the memory-controller layer includes at least one external interface configured to transmit data to and from the memory module. Furthermore, the memory module can include an optical layer. The optical layer can be included in the stack and has a bus waveguide to transmit data to and from the at least one memory controller. The external interface can be an optical external interface which interfaces with the optical layer.