Patents by Inventor Nathan Ou

Nathan Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12224253
    Abstract: Transmission pathways in substrates, and associated methods are shown. Example transmission pathways include a semiconductor substrate with a core, a dielectric layer fixed on the core, at least one first electrical transmission pathway extending through at least one of the dielectric layer and the core. The first pathway includes a magnetic material disposed within the at least the core of the at least one first electrical transmission pathway, at least one second electrical transmission pathway extending through the magnetic material, a nickel layer disposed on inner circumferential surface of the magnetic material at least within the second electrical transmission pathway, a copper layer disposed on at least the nickel layer within the second electrical transmission pathway. The dielectric spacer or the nickel layer separates the copper layer from the magnetic material.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: February 11, 2025
    Assignee: Intel Corporation
    Inventors: Xin Ning, Brandon C. Marin, Kyu Oh Lee, Siddharth K. Alur, Numair Ahmed, Brent Williams, Mollie Stewart, Nathan Ou, Cary Kuliasha
  • Publication number: 20230092492
    Abstract: Transmission pathways in substrates, and associated methods are shown. Example transmission pathways include a semiconductor substrate with a core, a dielectric layer fixed on the core, at least one first electrical transmission pathway extending through at least one of the dielectric layer and the core. The first pathway includes a magnetic material disposed within the at least the core of the at least one first electrical transmission pathway, at least one second electrical transmission pathway extending through the magnetic material, a nickel layer disposed on inner circumferential surface of the magnetic material at least within the second electrical transmission pathway, a copper layer disposed on at least the nickel layer within the second electrical transmission pathway. The dielectric spacer or the nickel layer separates the copper layer from the magnetic material.
    Type: Application
    Filed: September 20, 2021
    Publication date: March 23, 2023
    Inventors: Xin Ning, Brandon C. Marin, Kyu Oh Lee, Siddharth K. Alur, Numair Ahmed, Brent Williams, Mollie Stewart, Nathan Ou, Cary Kuliasha