Patents by Inventor Nathan R. C. Kemeling

Nathan R. C. Kemeling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming interconnection in semiconductor device
    Patent number: 7354852
    Abstract: A multilayer interconnection structure is formed by a method comprising the steps of: Forming a low dielectric constant film on a substrate, curing the low dielectric constant film by irradiating it with UV light, laminating a UV blocking film, laminating a next low dielectric constant film, and curing the next low dielectric constant film by irradiating it with UV light.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: April 8, 2008
    Assignee: ASM Japan K.K.
    Inventors: Kiyohiro Matsushita, Naoki Ohara, Nathan R. C. Kemeling