Abstract: The present disclosure is directed towards systems and method for actively tuning a phase locked loop based on vibration excitation levels experienced by the phase locked loop. A bandwidth of the phase locked loop can be actively increased or decreased based upon a detected vibration level. In an embodiment, the phase locked loop includes a controllable oscillator, an output module, a filter module and a detector. The filter module can be configured to receive a bandwidth control signal to modify a bandwidth of the phase locked loop based on a vibration signal. In an embodiment, the vibration signal corresponds to a vibration level experienced by the phased locked loop. The detector can be configured to receive a PLL output signal from the output module and to receive a PLL input signal.

Abstract: The present disclosure is directed towards systems and method for actively tuning a phase locked loop based on vibration excitation levels experienced by the phase locked loop. A bandwidth of the phase locked loop can be actively increased or decreased based upon a detected vibration level. In an embodiment, the phase locked loop includes a controllable oscillator, an output module, a filter module and a detector. The filter module can be configured to receive a bandwidth control signal to modify a bandwidth of the phase locked loop based on a vibration signal. In an embodiment, the vibration signal corresponds to a vibration level experienced by the phased locked loop. The detector can be configured to receive a PLL output signal from the output module and to receive a PLL input signal.

Abstract: One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.

Abstract: One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.