Patents by Inventor Nathan Speer

Nathan Speer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyurethane CMP pads having a high modulus ratio
    Patent number: 10562149
    Abstract: A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: February 18, 2020
    Assignee: Cabot Microelectronics Corporation
    Inventors: Lin Fu, Rui Ma, Nathan Speer, Chen-Chih Tsai, Kathryn Bergman
  • POLYURETHANE CMP PADS HAVING A HIGH MODULUS RATIO
    Publication number: 20170087688
    Abstract: A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 30, 2017
    Inventors: Lin FU, Rachel Ma, Nathan Speer, Chen-Chih Tsai, Kathryn Bergman