Abstract: A method of qualifying a process tool includes steps of: (a) finding a plurality of pre-scan defect locations on a surface of a semiconductor wafer; (b) subjecting the semiconductor wafer to processing by the process tool; (c) finding a plurality of post-scan defect locations on the surface of the semiconductor wafer; and (d) calculating a plurality of defect locations added by the process tool from the pre-scan defect locations and the post-scan defect locations.

Abstract: A method of qualifying a process tool includes steps of: (a) finding a plurality of pre-scan defect locations on a surface of a semiconductor wafer; (b) subjecting the semiconductor wafer to processing by the process tool; (c) finding a plurality of post-scan defect locations on the surface of the semiconductor wafer; and (d) calculating a plurality of defect locations added by the process tool from the pre-scan defect locations and the post-scan defect locations.

Abstract: A wafer edge inspection method and apparatus include a review tool that captures images of the semiconductor wafer. According to various embodiments, the present invention also includes a map of points of interest proximate to the edge of the wafer, automatic image capturing at the points of interest, fake defect locations defining the points of interest, a database in which the images are stored and computer-searchable for detailed defect analysis, a software tool for controlling the method and apparatus and/or context information identifying the points of interest, the inspected wafer and/or the fabrication station/step preceding the inspection.