Abstract: A light redirecting film includes a first layer disposed on a second layer with structured major surfaces of the first and second layers facing each other. An optically reflective layer or a metal layer is disposed between the first and second layers. The first layer can be a hot melt adhesive layer and the second layer can be a polymeric layer. The first and second layers can be unitary layers. The first layer can be a first polymeric layer having a softening temperature T1 and the second layer can be a second polymeric layer having a softening temperature T2 greater than T1. Heating and/or applying pressure to the film changes an optical characteristic of the film by less than about 5%.

Abstract: This disclosure describes multilayer polymer films that are configured so that successive constituent layer packets may be delaminated in continuous sheet forms from the remaining film. This disclosure further describes compositions, materials, and methods for minimizing the likelihood of removing multiple layer packets together including by increasing the peel force between layer packets. In some embodiments, that the peel force becomes successively greater from the interface between the first layer packet and the second layer packet to the interface between the next to last ((n?1)th layer packet) and the last (nth layer packet).

Abstract: A light redirecting film includes a first layer disposed on a second layer with structured major surfaces of the first and second layers facing each other. An optically reflective layer or a metal layer is disposed between the first and second layers. The first layer can be a hot melt adhesive layer and the second layer can be a polymeric layer. The first and second layers can be unitary layers. The first layer can be a first polymeric layer having a softening temperature T1 and the second layer can be a second polymeric layer having a softening temperature T2 greater than T1. Heating and/or applying pressure to the film changes an optical characteristic of the film by less than about 5%.

Abstract: The present application generally relates to top films comprising a semi-crystalline core polymeric layer sandwiched by two amorphous skin layers, one on each side of the core polymeric layer. In preferred embodiments, an acrylic layer adjacent one of the amorphous skin layers is present as an outermost layer. The present application is also directed to retroreflective articles comprising such top films.

Abstract: A dental appliance for positioning a patients teeth includes a polymeric shell with a plurality of cavities for receiving one or more teeth. The polymeric shell includes at least 3 alternating polymeric layers AB, wherein layer A includes a thermoplastic polymer A, layer B includes a thermoplastic polymer B, and the thermoplastic polymer B is different from the thermoplastic polymer A. Each of the thermoplastic polymers A and B have a flexural modulus of about 1.0 GPa to about 4.0 GPa; and each of the thermoplastic polymers A and B have a glass transition temperature (Tg) greater than about 40° C.

Abstract: Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.

Abstract: Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between ?40° C. and ?10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

Abstract: Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260° C. without degradation or flowing, remains optically transparent, and after heating to 260° C. remains cleanly removable.

Abstract: Polyester pressure-sensitive adhesives are described. The polyester includes at least two different diacid residues and at least two different diol residues. The polyester includes at least one pendant group containing an alkenyl group. A ratio of a total number of the at least one pendant group to the total number of ester groups in the polyester is in a range of 0.001 to 0.1. The polyester has a glass transition temperature in a range of ?50° C. to ?10° C.

Abstract: Polyester pressure-sensitive adhesives are described. The polyester includes at least two different diacid residues and at least two different diol residues. The at least two different diacid residues include, based on the total moles of the at least two diacid residues, 20 to 80 mole percent of a residue of at least one aromatic dicarboxylic acid, and 20 to 80 mole percent of at least one of a residue of adipic acid or sebacic acid. The polyesters may include at least one pendant group containing an alkenyl group.

Abstract: An organic light emitting diode (OLED) cushioning film including a foamed layer is described. The foamed layer includes an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent. The tackifier has a softening point of at least 130° C. A light emitting article including an OLED layer laminated to the OLED cushioning film is described.

Abstract: Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between ?40° C. and ?10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

Abstract: Polyester pressure-sensitive adhesives are described. The polyester includes at least two different diacid residues and at least two different diol residues. The at least two different diacid residues include, based on the total moles of the at least two diacid residues, 20 to 80 mole percent of a residue of at least one aromatic dicarboxylic acid, and 20 to 80 mole percent of at least one of a residue of adipic acid or sebacic acid. The polyesters may include at least one pendant group containing an alkenyl group.

Abstract: Polyester pressure-sensitive adhesives are described. The polyester includes at least two different diacid residues and at least two different diol residues. The polyester includes at least one pendant group containing an alkenyl group. A ratio of a total number of the at least one pendant group to the total number of ester groups in the polyester is in a range of 0.001 to 0.1. The polyester has a glass transition temperature in a range of ?50° C. to ?10° C.