Patents by Inventor Nathaniel James Gibbs
Nathaniel James Gibbs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8535393Abstract: A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light.Type: GrantFiled: January 4, 2011Date of Patent: September 17, 2013Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, John Edward Sheets, II, Trevor Joseph Timpane
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Patent number: 8536587Abstract: A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light.Type: GrantFiled: January 3, 2011Date of Patent: September 17, 2013Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, John Edward Sheets, II, Trevor Joseph Timpane
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Patent number: 8108820Abstract: A method, program product and apparatus include extending lengths that project from a microchip trace into dielectric material. The extending lengths may not connect to another trace. Placement of the extending lengths may be optimized to increase the dissipation of heat from the trace, while maintaining an acceptable level of capacitance.Type: GrantFiled: September 11, 2008Date of Patent: January 31, 2012Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20110269077Abstract: A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction minor arrays on the substrate, each diffraction minor array of the set of at least three diffraction minor arrays comprising a single row of minors, all mirrors in any particular diffraction minor array spaced apart a same distance, minors in different diffraction minor arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.Type: ApplicationFiled: July 6, 2011Publication date: November 3, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Patent number: 7989337Abstract: A method and structure are provided for implementing vertical airgap structures between chip metal layers. A first metal layer is formed. A first layer of silicon dioxide dielectric is deposited onto the first metal layer. A vertical air gap is etched from the first layer of silicon dioxide dielectric above the first metal layer. A second layer of silicon dioxide dielectric is deposited and the vertical air gap is sealed. A next trace layer is etched from the second layer of silicon dioxide dielectric and a via opening is etched from the second and first layers of silicon dioxide dielectric. Then metal is deposited into the next trace layer and metal is deposited into the via opening.Type: GrantFiled: April 27, 2009Date of Patent: August 2, 2011Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Patent number: 7979824Abstract: A computer implemented method, apparatus and program product provide automated processes for determining the most cost-effective use of airgaps in a microchip. The performance gains realized by using airgaps for a given net or layer may be calculated. These improvements may be paired to a monetary cost associated with implementing the applicable airgaps at that net/layer. The paired benefit and cost of the airgap scenario may be compared to other possible airgap uses at other layers/nets to determine which airgaps provide the best improvement for the lowest cost.Type: GrantFiled: September 11, 2008Date of Patent: July 12, 2011Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Patent number: 7935546Abstract: A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light.Type: GrantFiled: February 6, 2008Date of Patent: May 3, 2011Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, John Edward Sheets, II, Trevor Joseph Timpane
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Publication number: 20110096310Abstract: A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light.Type: ApplicationFiled: January 3, 2011Publication date: April 28, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, John Edward Sheets, II, Trevor Joseph Timpane
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Publication number: 20110096329Abstract: A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light.Type: ApplicationFiled: January 4, 2011Publication date: April 28, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, John Edward Sheets, II, Trevor Joseph Timpane
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Patent number: 7875987Abstract: A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction mirror arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.Type: GrantFiled: September 26, 2007Date of Patent: January 25, 2011Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20110013187Abstract: A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction mirror arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.Type: ApplicationFiled: September 23, 2010Publication date: January 20, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20110008719Abstract: A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction minor arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.Type: ApplicationFiled: September 23, 2010Publication date: January 13, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20100270682Abstract: A method and structure are provided for implementing vertical airgap structures between chip metal layers. A first metal layer is formed. A first layer of silicon dioxide dielectric is deposited onto the first metal layer. A vertical air gap is etched from the first layer of silicon dioxide dielectric above the first metal layer. A second layer of silicon dioxide dielectric is deposited and the vertical air gap is sealed. A next trace layer is etched from the second layer of silicon dioxide dielectric and a via opening is etched from the second and first layers of silicon dioxide dielectric. Then metal is deposited into the next trace layer and metal is deposited into the via opening.Type: ApplicationFiled: April 27, 2009Publication date: October 28, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20100063781Abstract: A method, program product and apparatus include extending lengths that project from a microchip trace into dielectric material. The extending lengths may not connect to another trace. Placement of the extending lengths may be optimized to increase the dissipation of heat from the trace, while maintaining an acceptable level of capacitance.Type: ApplicationFiled: September 11, 2008Publication date: March 11, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20100064270Abstract: A computer implemented method, apparatus and program product provide automated processes for determining the most cost-effective use of airgaps in a microchip. The performance gains realized by using airgaps for a given net or layer may be calculated. These improvements may be paired to a monetary cost associated with implementing the applicable airgaps at that net/layer. The paired benefit and cost of the airgap scenario may be compared to other possible airgap uses at other layers/nets to determine which airgaps provide the best improvement for the lowest cost.Type: ApplicationFiled: September 11, 2008Publication date: March 11, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20090195787Abstract: A method, structure, system of aligning a substrate to a photomask. The method includes: directing incident light through a pattern of clear regions transparent to the incident light in an opaque-to-the-incident-light region of a photomask, through a lens and onto a photodiode formed in a substrate, the photodiodes electrically connected to a light emitting diode formed in the substrate, the light emitting diode emitting light of different wavelength than a wavelength of the incident lights; measuring an intensity of emitted light from light emitting diode; and adjusting alignment of the photomask to the substrate based on the measured intensity of emitted light.Type: ApplicationFiled: February 6, 2008Publication date: August 6, 2009Inventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, John Edward Sheets, II, Trevor Joseph Timpane
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Patent number: 7532037Abstract: A method for enhancing a CML driver circuit to allow efficient, and accurate measurement of the magnitude of the voltage domain noise present near a CML driver in an integrated circuit. The disclosed method for enhancing a CML driver circuit to enable quiet driver measurement includes providing a predetermined low impedance path from the power rail of said CML driver circuit via a first node to the output pins of the circuit and providing a predetermined low impedance path from the ground rail of said CML driver circuit via a second node to the output pins of the circuit. The method also includes disabling the current source causing the pull-up termination circuitry to become high impedance, and the logic driving said inputs of the CML circuit to exist in a low state and performing a low impedance measurement of the power rail noise, ground rail noise and the chip noise in the region of the CML driver.Type: GrantFiled: May 5, 2008Date of Patent: May 12, 2009Assignee: International Business Machines CorporationInventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane
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Publication number: 20090081813Abstract: A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction mirror arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.Type: ApplicationFiled: September 26, 2007Publication date: March 26, 2009Inventors: Axel Aguado Granados, Benjamin Aaron Fox, Nathaniel James Gibbs, Andrew Benson Maki, Trevor Joseph Timpane