Abstract: A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.

Abstract: A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: Improved nozzle design that discharges more powerful, more focused fluid streams through a series of nozzle orifices distributed along a length of the nozzle. The present invention may be incorporated into a wide range of microelectronic device manufacturing processes and equipment types for which an array of more forceful, more focused process streams are desired for treating microelectronic workpieces. The present invention is particularly useful to cryogenically clean microelectronic workpieces, where the improvements allow the conventionally more troublesome smaller contaminant particles to be cleaningly removed with greater particle removal efficiency.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: An aerosol cleaning apparatus and a method of treating a substrate within such an apparatus prevent contaminant recirculation by controlling the post-impingement exhaust flow through control of the aerodynamic behavior of the contaminant laden exhaust stream. By the present invention, the post-impingement exhaust flow is divided into two streams. A first stream is the main stream flowing initially over the contaminated side of the wafer and carrying most of the suspended contaminants into the exhaust. The second stream flows initially over the cleaned side of the wafer and eventually into the exhaust stream. A flow separator is provided for dividing the post-impingement aerosol spray into plural flow streams.