Abstract: There is provided an electronic component excellent in moisture resistance capable of ensuring electrical connection between electrodes and hermeticity of a sealed region including a vibrating part and suppressing an increase in size.

Abstract: It is possible to prevent defects arising when resin-sealing electronic components, caused by leakage defects, resin interfusion defects, or the like, and it is possible to easily resin-seal a number of electronic components all together.

Abstract: There is provided an electronic component excellent in moisture resistance capable of ensuring electrical connection between electrodes and hermeticity of a sealed region including a vibrating part and suppressing an increase in size.

Abstract: A SAW filter, comprising a piezoelectric substrate and a first interdigital electrode having a period of L and disposed on the piezoelectric substrate. The filter converts an input voltage into a surface acoustic wave on the piezoelectric substrate. A second interdigital electrode having the period of L is disposed on the piezoelectric substrate in parallel with the first interdigital electrode with respect to a propagating direction of the surface acoustic wave. The second interdigital electrode converts the surface acoustic wave on the piezoelectric substrate into a voltage. A pair of first reflectors having a period of L/2 are disposed on the piezoelectric substrate and beside both sides of a pair of the first and second interdigital electrodes in the propagating direction keeping a distance of nL/2+0.5 L therefrom, where n is an integer equal to or larger than zero.

Abstract: A surface acoustic wave device comprises a diamond layer (12) or a substrate (11) with a diamond layer (12) formed thereon, an Al electrode (13) formed on the diamond layer (12), and a ZnO piezoelectric thin film layer (14) formed on the diamond layer (12) with the Al electrode (13) covered by the ZnO piezoelectric thin film layer (14). The ZnO piezoelectric thin film layer (14) has a thickness h1 within a range defined by 0.65.ltoreq.kh1.ltoreq.0.75 while the Al electrode (13) has a thickness h2 within a range defined by 0.03.ltoreq.kh2.ltoreq.0.04, where k is given by k=2 .pi./.lambda. and .lambda. represents an electrode period.

Abstract: A surface acoustic wave (SAW) device in accordance with the present invention is constituted in such a way that a SAW device chip 2 in which electrode patterns are formed is accommodated within a package composed of a ceramic board 1 and a metallic cap 4. The SAW device comprises metallic patterns 5a and 5b provided at the ceramic board 1 as input/output terminals of the package and having convex portions 6a and 6b connected electrically to bonding pads 8a and 8b of a SAW device chip, respectively, and an elastic body 3 arranged between the metallic cap 4 and the SAW device chip 2. The SAW device chip 2 is fixed such that the bonding pads 8a and 8b are pushed against the convex portions 6a and 6b under a predetermined contact pressure by elastic force of the elastic body 3.