Abstract: A socket assembly used in an electronic component test apparatus for testing a device under test (DUT) having a first device antenna, includes a socket in which the DUT is mounted, a pressing portion, disposed between an antenna unit and the socket, that presses the DUT toward the socket, the antenna unit having a first measuring antenna opposed to the socket, and a reinforcement frame on which the pressing portion is stacked. A material in the pressing portion has a lower dielectric constant than a material in the reinforcement frame.

Abstract: The invention relates to a test arrangement for over-the-air testing an angled device under test, wherein the test arrangement comprises a carrier structure and a device-under-test socket which is coupled to the carrier structure. The device-under-test socket is configured to establish an electrical contact with an inner surface of the angled device under test or with a connector which is arranged on the inner surface of the angled device under test. The carrier structure comprises an opening extending away from the device-under-test socket in a direction of an outward surface normal of a first outer surface of the angled device-under-test.

Abstract: An electronic component testing apparatus for testing a device under test (DUT) includes: a socket unit that is electrically connected to the DUT; a first wiring board that includes a board opening; and a tester that includes a test head in which the first wiring board is mounted. The socket unit includes a first socket that faces a first main surface of the DUT and is electrically connected to the DUT and the first wiring board. The second socket that is exposed from the first wiring board through the board opening, contacts a second main surface of the DUT on a side opposite to the first main surface, and includes: a base that contacts the second main surface; and a test antenna unit that is electrically connected to the tester and faces a device antenna unit of the DUT.

Abstract: An electronic component testing apparatus for testing a device under test (DUT) includes: a socket unit that is electrically connected to the DUT; a first wiring board that includes a board opening; and a tester that includes a test head in which the first wiring board is mounted. The socket unit includes a first socket that faces a first main surface of the DUT and is electrically connected to the DUT and the first wiring board. The second socket that is exposed from the first wiring board through the board opening, contacts a second main surface of the DUT on a side opposite to the first main surface, and includes: a base that contacts the second main surface; and a test antenna unit that is electrically connected to the tester and faces a device antenna unit of the DUT.

Abstract: An electronic component testing apparatus is used for testing a device under test (DUT). The electronic component testing apparatus includes: a socket unit that is electrically connected to the DUT; a first wiring board; and a tester that comprises a test head in which the first wiring board is mounted. The socket unit includes a first socket and a second socket. The second socket includes a base and a test antenna unit. The tester tests the DUT by transmitting and receiving radio waves between a device antenna unit of the DUT and the test antenna unit while the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head through the second socket.

Abstract: An electronic component handling apparatus includes: a moving device that moves a device under test (DUT) including a first antenna and presses the DUT against a socket. The moving device includes a holder that holds the DUT and a second antenna that receives a radio wave radiated from the first antenna or that radiates the radio wave to the first antenna.

Abstract: The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.

Abstract: An electronic component presser is included in an electronic component testing apparatus used to test a device under test (DUT). The electronic component testing apparatus includes an electronic component handler, an electronic component tester, and a first socket. The electronic component presser connects to the electronic component handler and to the electronic component tester. The electronic component presser includes: a holding plate that holds the DUT that has been carried to the holding plate by a contact arm of the electronic component handler; a transport unit that moves the DUT between the holding plate and the first socket; a pusher that presses the DUT that has been disposed on the first socket; and an antenna unit comprising a measurement antenna that faces a device antenna of the DUT disposed on the first socket.

Abstract: An electronic component handling apparatus includes: a thermostatic chamber in which a socket disposed, the socket electrically being connectable to a device under test (DUT) including a first antenna; a moving device that moves the DUT and presses the DUT against the socket; an anechoic chamber disposed adjacent to the thermostatic chamber; a second antenna disposed inside the thermostatic chamber; and a first window that transmits radio waves radiated from the first or second antenna. The thermostatic chamber has a first opening on a wall surface of the thermostatic chamber. The anechoic chamber has a radio wave absorber and a second opening that opens toward a transmission direction of the radio waves from or to the second antenna. The thermostatic chamber and the anechoic chamber are connected to each other to make the first opening and the second opening face each other.

Abstract: An electronic component presser is included in an electronic component testing apparatus used to test a device under test (DUT). The electronic component testing apparatus includes an electronic component handler, an electronic component tester, and a first socket. The electronic component presser connects to the electronic component handler and to the electronic component tester. The electronic component presser includes: a holding plate that holds the DUT that has been carried to the holding plate by a contact arm of the electronic component handler; a transport unit that moves the DUT between the holding plate and the first socket; a pusher that presses the DUT that has been disposed on the first socket; and an antenna unit comprising a measurement antenna that faces a device antenna of the DUT disposed on the first socket.

Abstract: An electronic component handling apparatus includes: a thermostatic chamber in which a socket disposed, the socket electrically being connectable to a device under test (DUT) including a first antenna; a moving device that moves the DUT and presses the DUT against the socket; an anechoic chamber disposed adjacent to the thermostatic chamber; a second antenna disposed inside the thermostatic chamber; and a first window that transmits radio waves radiated from the first or second antenna. The thermostatic chamber has a first opening on a wall surface of the thermostatic chamber. The anechoic chamber has a radio wave absorber and a second opening that opens toward a transmission direction of the radio waves from or to the second antenna. The thermostatic chamber and the anechoic chamber are connected to each other to make the first opening and the second opening face each other.

Abstract: An electronic component handling apparatus includes: a moving device that moves a device under test (DUT) including a first antenna and presses the DUT against a socket. The moving device includes a holder that holds the DUT and a second antenna that receives a radio wave radiated from the first antenna or that radiates the radio wave to the first antenna.

Abstract: An electronic component testing apparatus is used for testing a device under test (DUT). The electronic component testing apparatus includes: a socket unit that is electrically connected to the DUT; a first wiring board; and a tester that comprises a test head in which the first wiring board is mounted. The socket unit includes a first socket and a second socket. The second socket includes a base and a test antenna unit. The tester tests the DUT by transmitting and receiving radio waves between a device antenna unit of the DUT and the test antenna unit while the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head through the second socket.

Abstract: The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L2 of the second contact probe 22 is shorter than the length L1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.