Abstract: Provided is an ultrasonic inspection device and method capable of generating a clear image of a desired bonding interface without an S-Gate. The controller in the ultrasonic inspection device is configured to: (A) define a first gate indicating a time range in which a part of a reflected wave is extracted based on a predetermined condition received; (B) define one or more second gates each indicating a time width smaller than that of the first gate before an end time of the first gate; (C) for each of a plurality of measurement points of an inspection object, (C1) detect a lower layer echo or a local peak, (C2) adjust a reception time of the reflected wave based on the lower layer echo or the local peak; and (D) generate a cross-sectional image of the inspection object based on the reflected wave.

Abstract: An ultrasound image apparatus irradiates a bonded wafer in which two or more wafers are bonded with an ultrasonic wave to generate an image of the bonded surface between the wafers. An ultrasonic probe irradiates the bonded wafer with the ultrasonic wave on a lower side of the bonded wafer. A liquid ejection unit moves together with the ultrasonic probe while continuously ejecting a liquid toward a bottom surface such that a liquid film in contact with the bottom surface is formed between the liquid ejection unit and the bottom surface of the bonded wafer. Also, a gas ejection device ejects gas for pushing down the liquid toward an outer peripheral end portion of the bonded wafer so that the liquid ejected from the liquid ejection unit does not infiltrate into the bonded surface from the outer peripheral end portion of the bonded wafer.

Abstract: An ultrasonic imaging device includes an ultrasonic probe including a piezoelectric device transmitting ultrasonic waves to a sample and receiving echo waves, an X axis scanner and a Y axis scanner scanning the sample and positions the probe at a scanning position, a frequency controller controlling a frequency of a received signal in accordance with the position of the scanning position, a signal processing unit processing the received signal, and an image generator generating an ultrasonic wave image at the frequency based on an output of the signal processing unit. The frequency controller generates and supplies a burst signal having a predetermined frequency by a burst wave oscillator to the piezoelectric device of the ultrasonic probe to generate the ultrasonic waves having a predetermined frequency.

Abstract: The ultrasonic imaging device includes the ultrasonic probe including the piezoelectric device transmitting ultrasonic waves to the sample and receives echo waves, the X axis scanner and the Y axis scanner scanning the sample and positions the probe at a scanning position, the frequency controller controlling the frequency of the received signal in accordance with the position of the scanning position, the signal processing unit processing the received signal, the image generator generating ultrasonic wave image at the frequency on the basis of the output of the signal processing unit. The frequency controller generates and supplies a burst signal having the predetermined frequency by the burst wave oscillator to the piezoelectric device of the ultrasonic probe to generate the ultrasonic waves having a predetermined frequency.