Patents by Inventor Natsuki TAKEISHI

Natsuki TAKEISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230307346
    Abstract: A method of manufacturing a semiconductor device, includes; preparing an insulated circuit substrate including a circuit layer having a main surface and a side surface inclined to a normal direction of the main surface; irradiating the side surface of the circuit layer with a laser beam so as to roughen at least a part of the side surface of the circuit layer and provide an oxide film on the roughened side surface of the circuit layer; and bonding a semiconductor chip to the main surface of the circuit layer via a solder layer.
    Type: Application
    Filed: January 27, 2023
    Publication date: September 28, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yasuaki HOZUMI, Fumihiko MOMOSE, Natsuki TAKEISHI, Ryoto UCHIYAMA