Patents by Inventor Natsuki Yoshida

Natsuki Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972949
    Abstract: A device for manufacturing a SiC substrate, in which the occurrence of a work-affected layer is reduced, or from which a work-affected layer is removed, comprises: a main container which can accommodate a SiC substrate and which generates, by heating, a vapor pressure of a vapor-phase species including elemental Si and a vapor-phase species including elemental C in an internal space; and a heating furnace for accommodating the main container, generating a vapor pressure of the vapor-phase species including elemental Si in the internal space, and heating so that a temperature gradient is formed; the main container having an etching space formed by causing a portion of the main container disposed on the low-temperature side of the temperature gradient and the SiC substrate to face each other in a state in which the SiC substrate is disposed on the high-temperature side of the temperature gradient.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: April 30, 2024
    Assignees: KWANSEI GAKUIN EDUCATIONAL FOUNDATION, TOYOTA TSUSHO CORPORATION
    Inventors: Tadaaki Kaneko, Natsuki Yoshida, Kazufumi Aoki
  • Publication number: 20220181155
    Abstract: A device for manufacturing a SiC substrate, in which the occurrence of a work-affected layer is reduced, or from which a work-affected layer is removed, comprises: a main container which can accommodate a SiC substrate and which generates, by heating, a vapor pressure of a vapor-phase species including elemental Si and a vapor-phase species including elemental C in an internal space; and a heating furnace for accommodating the main container, generating a vapor pressure of the vapor-phase species including elemental Si in the internal space, and heating so that a temperature gradient is formed; the main container having an etching space formed by causing a portion of the main container disposed on the low-temperature side of the temperature gradient and the SiC substrate to face each other in a state in which the SiC substrate is disposed on the high-temperature side of the temperature gradient.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 9, 2022
    Inventors: Tadaaki KANEKO, Natsuki YOSHIDA, Kazufumi AOKI
  • Publication number: 20220181149
    Abstract: A device for manufacturing a SiC substrate, in which formation of macro-step bunching is suppressed, comprises: a main body container that is capable of accommodating a SiC substrate and generates, by heating, a vapor pressure of gaseous species containing Si elements and gaseous species containing C elements, in an internal space; and a heating furnace that accommodates the main body container and performs heating so that a vapor pressure of the gaseous species containing Si elements is generated and a temperature gradient is formed, wherein the main body container has an etching space S1 and a Si vapor supply source capable of supplying Si vapor into the main body container, the etching space S1 being formed by making the SiC substrate face a portion of the main body container arranged on a lower-temperature side of the temperature gradient while the SiC substrate is disposed on a higher-temperature side of the temperature gradient.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 9, 2022
    Inventors: Tadaaki KANEKO, Natsuki YOSHIDA, Kazufumi AOKI
  • Publication number: 20220178048
    Abstract: An apparatus for producing an SiC substrate, by which an SiC substrate having a thin base substrate layer is able to be produced, while suppressing deformation or breakage, includes a main container which is capable of containing an SiC base substrate, and which produces a vapor pressure of a vapor-phase species containing elemental Si and a vapor-phase species containing elemental C within the internal space by means of heating; and a heating furnace which contains the main container and heats the main container so as to form a temperature gradient, while producing a vapor pressure of a vapor-phase species containing elemental Si within the internal space. The main container has a growth space in which a growth layer is formed on one surface of the SiC base substrate, and an etching space in which the other surface of the SiC base substrate is etched.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 9, 2022
    Inventors: Tadaaki KANEKO, Natsuki YOSHIDA, Kazufumi AOKI
  • Patent number: 9446120
    Abstract: The present invention provides a therapeutic or improving agent for a lifestyle-related disease, containing an expression vector encoding a chimeric Hepatitis B virus core antigen polypeptide inserted with an amino acid sequence containing a specific epitope of the lifestyle-related disease-related factor, wherein the amino acid sequence containing the specific epitope is inserted between the amino acid residues 80 and 81 of the hepatitis B virus core antigen polypeptide.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: September 20, 2016
    Assignees: Osaka University, Anges MG, Inc.
    Inventors: Ryuichi Morishita, Hironori Nakagami, Hiroshi Koriyama, Futoshi Nakagami, Natsuki Yoshida
  • Publication number: 20140099335
    Abstract: The present invention provides a therapeutic or improving agent for a lifestyle-related disease, containing an expression vector encoding a chimeric Hepatitis B virus core antigen polypeptide inserted with an amino acid sequence containing a specific epitope of the lifestyle-related disease-related factor, wherein the amino acid sequence containing the specific epitope is inserted between the amino acid residues 80 and 81 of the hepatitis B virus core antigen polypeptide.
    Type: Application
    Filed: April 13, 2012
    Publication date: April 10, 2014
    Applicants: ANGES MG, INC., OSAKA UNIVERSITY
    Inventors: Ryuichi Morishita, Hironori Nakagami, Hiroshi Koriyama, Futoshi Nakagami, Natsuki Yoshida
  • Patent number: 4632550
    Abstract: A measuring method for a time resolved emission spectrum or a time resolved excitation spectrum, wherein when emission transient waveforms from a pulse-excited sample are measured by the time correlation photon counting method; the emission transient waveforms are measured at every optimum wavelength in a problematical emission spectrum region; the measured emission transient waveforms are stored in a memory in order and at every wavelength; all the transient waveforms in each wavelength are measured; thereafter, the time resolved emission spectrum or the time resolved excitation spectrum is produced on the basis of all the above-mentioned stored emission transient waveform data, thereby enabling the proper spectrum to be produced efficiently.
    Type: Grant
    Filed: October 5, 1984
    Date of Patent: December 30, 1986
    Assignee: Horiba, Ltd.
    Inventors: Kiyoaki Hara, Issei Yokoyama, Natsuki Yoshida