Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes: a first insulating layer; a plurality of wiring patterns formed on one surface of the first insulating layer; a dummy pattern formed, on the one surface of the first insulating layer, between the nearby wiring patterns; and a second insulating layer made of resin and formed on the one surface of the first insulating layer so as to cover the nearby wiring patterns and the dummy pattern, wherein the dummy pattern is a dot pattern arranged at a center portion between the nearby wiring patterns, and wherein a height of at least one dot constituting the dummy pattern is lower than heights of the nearby wiring patterns.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes: a first insulating layer; a plurality of wiring patterns formed on one surface of the first insulating layer; a dummy pattern formed, on the one surface of the first insulating layer, between the nearby wiring patterns; and a second insulating layer made of resin and formed on the one surface of the first insulating layer so as to cover the nearby wiring patterns and the dummy pattern, wherein the dummy pattern is a dot pattern arranged at a center portion between the nearby wiring patterns, and wherein a height of at least one dot constituting the dummy pattern is lower than heights of the nearby wiring patterns.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes a pad, an insulation layer that covers the pad, and a via wiring extending through the insulation layer and connected to the pad. The via wiring includes a first via portion, which has a diameter that is decreased from an upper surface of the insulation layer toward the pad, and a second via portion, which has a diameter that is increased from a lower end of the first via portion toward the pad. The diameter of the second via portion at an upper surface of the pad is larger than the diameter of the first via portion at the upper surface of the insulation layer.

Abstract: A wiring substrate includes first through holes extending through an insulation layer, first via wirings formed in the first through holes, a conductive pattern connected to the first via wirings, recesses formed in the first via wirings, and a protective insulation layer covering the conductive pattern and the first via wirings. The first via wirings, the conductive pattern, the recesses, and the protective insulation layer form an identification mark identifiable as a particular shape including a character or a symbol. Each recess is defined by an upper surface of the corresponding first via wiring and includes a curved side wall and a bottom wall that is located at a lower position than an upper surface of the conductive pattern. The protective insulation layer is thicker over the first via wirings than over the conductive pattern.

Abstract: A wiring substrate includes first through holes extending through an insulation layer, first via wirings formed in the first through holes, a conductive pattern connected to the first via wirings, recesses formed in the first via wirings, and a protective insulation layer covering the conductive pattern and the first via wirings. The first via wirings, the conductive pattern, the recesses, and the protective insulation layer form an identification mark identifiable as a particular shape including a character or a symbol. Each recess is defined by an upper surface of the corresponding first via wiring and includes a curved side wall and a bottom wall that is located at a lower position than an upper surface of the conductive pattern. The protective insulation layer is thicker over the first via wirings than over the conductive pattern.