Patents by Inventor Natsuko Okumura

Natsuko Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7332219
    Abstract: A tape-shaped insulating material comprises an insulating substrate and a pressure-sensitive adhesive layer provided on one side or both sides of the substrate, wherein the pressure-sensitive adhesive layer is made of an aqueous dispersion type acrylic pressure-sensitive adhesive containing a polymer emulsion that is a product of emulsion polymerization of a monomer mainly composed of C4 to C12 alkyl(meth)acrylate ester in the presence of an emulsifying agent. The tape-shaped insulating material has an electrolytic corrosion coefficient according to JIS C-2338 of 0.98 or more, and the pressure-sensitive adhesive layer has good insulating characteristics.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: February 19, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Mitsuyoshi Shirai, Natsuko Okumura, Michirou Kawanishi
  • Publication number: 20040213992
    Abstract: A tape-shaped insulating material comprises an insulating substrate and a pressure-sensitive adhesive layer provided on one side or both sides of the substrate, wherein the pressure-sensitive adhesive layer is made of an aqueous dispersion type acrylic pressure-sensitive adhesive containing a polymer emulsion that is a product of emulsion polymerization of a monomer mainly composed of C4 to C12 alkyl(meth)acrylate ester in the presence of an emulsifying agent. The tape-shaped insulating material has an electrolytic corrosion coefficient according to JIS C-2338 of 0.98 or more, and the pressure-sensitive adhesive layer has good insulating characteristics.
    Type: Application
    Filed: January 28, 2004
    Publication date: October 28, 2004
    Inventors: Mitsuyoshi Shirai, Natsuko Okumura, Michirou Kawanishi