Patents by Inventor NATSUKO OOTANI

NATSUKO OOTANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230395617
    Abstract: There is provided a solid-state imaging device capable of preventing the sensitivity difference from being generated between the pixels. The fixed imaging device of the present disclosure includes: a first pixel; and a second pixel located in a first direction of the first pixel, in which each of the first and second pixels includes a first transistor and a second transistor, and the first and second transistors in the second pixel are disposed periodically in the first direction with respect to the first and second transistors in the first pixel.
    Type: Application
    Filed: October 19, 2021
    Publication date: December 7, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Mikinori ITO, Natsuko OOTANI, Yutaro KOMURO, Akira OKADA, Yuhei AOTANI, Yuichi YAMAGUCHI, Tsubasa SAKAKI, Masumi ABE, Kodai KANEYASU, Yuta NOGUCHI, Kazuki TAKAHASHI, Hirofumi YAMADA, Kohei YAMASHINA, Ryosuke TAKAHASHI, Yoshiki SAITO, Yusuke KIKUCHI, Yukihito IIDA, Kenichi OBATA, Ryuichi ITOH, Yuki UEMURA
  • Publication number: 20230034691
    Abstract: A solid-state imaging device according to an embodiment includes: a semiconductor substrate including a photoelectric conversion element; a lens disposed above a first light incident surface of the photoelectric conversion element; and a plurality of columnar structures disposed on a surface parallel to the first light incident surface that is located between a second light incident surface of the lens and the first light incident surface of the photoelectric conversion element. The columnar structure includes at least one of silicon, germanium, gallium phosphide, aluminum oxide, cerium oxide, hafnium oxide, indium oxide, tin oxide, niobium pentoxide, magnesium oxide, tantalum pentoxide, titanium pentoxide, titanium oxide, tungsten oxide, yttrium oxide, zinc oxide, zirconia, cerium fluoride, gadolinium fluoride, lanthanum fluoride, and neodymium fluoride.
    Type: Application
    Filed: October 3, 2022
    Publication date: February 2, 2023
    Inventors: MIKINORI ITO, YUTA NAKAMOTO, TOMOMI OKANO, YUYA KITABAYASHI, TAKASHI TANAKA, TOMOYUKI ARAI, NATSUKO OOTANI
  • Patent number: 11508767
    Abstract: A solid-state imaging device according to an embodiment includes: a semiconductor substrate including a photoelectric conversion element; a lens disposed above a first light incident surface of the photoelectric conversion element; and a plurality of columnar structures disposed on a surface parallel to the first light incident surface that is located between a second light incident surface of the lens and the first light incident surface of the photoelectric conversion element. The columnar structure includes at least one of silicon, germanium, gallium phosphide, aluminum oxide, cerium oxide, hafnium oxide, indium oxide, tin oxide, niobium pentoxide, magnesium oxide, tantalum pentoxide, titanium pentoxide, titanium oxide, tungsten oxide, yttrium oxide, zinc oxide, zirconia, cerium fluoride, gadolinium fluoride, lanthanum fluoride, and neodymium fluoride.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: November 22, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Mikinori Ito, Yuta Nakamoto, Tomomi Okano, Yuya Kitabayashi, Takashi Tanaka, Tomoyuki Arai, Natsuko Ootani
  • Publication number: 20220199668
    Abstract: The present technology relates to a solid-state imaging device capable of increasing sensitivity while reducing color mixing degradation. A solid-state imaging device includes: a substrate; a plurality of photoelectric conversion regions formed in the substrate; a trench that is formed between the photoelectric conversion regions, and penetrates the substrate; and a recessed region that includes a plurality of concave portions, and is provided above the photoelectric conversion regions and on the side of the light receiving surface of the substrate, in which the substrate includes a III-V semiconductor or polycrystalline SiXGe (1-x) (x=0 to 1). The recessed region is also provided below the photoelectric conversion regions and on the side of a surface of the substrate, the surface facing the light receiving surface. The present technology can be applied to back-illuminated solid-state imaging devices and the like, for example.
    Type: Application
    Filed: March 27, 2020
    Publication date: June 23, 2022
    Inventors: NATSUKO OOTANI, MIKINORI ITO, TAKASHI TANAKA, MASUMI ABE, SHOHEI SHIMADA
  • Publication number: 20210366964
    Abstract: A solid-state imaging device according to an embodiment includes: a semiconductor substrate including a photoelectric conversion element; a lens disposed above a first light incident surface of the photoelectric conversion element; and a plurality of columnar structures disposed on a surface parallel to the first light incident surface that is located between a second light incident surface of the lens and the first light incident surface of the photoelectric conversion element. The columnar structure includes at least one of silicon, germanium, gallium phosphide, aluminum oxide, cerium oxide, hafnium oxide, indium oxide, tin oxide, niobium pentoxide, magnesium oxide, tantalum pentoxide, titanium pentoxide, titanium oxide, tungsten oxide, yttrium oxide, zinc oxide, zirconia, cerium fluoride, gadolinium fluoride, lanthanum fluoride, and neodymium fluoride.
    Type: Application
    Filed: December 21, 2018
    Publication date: November 25, 2021
    Inventors: MIKINORI ITO, YUTA NAKAMOTO, TOMOMI OKANO, YUYA KITABAYASHI, TAKASHI TANAKA, TOMOYUKI ARAI, NATSUKO OOTANI