Patents by Inventor Natsuko Ueda

Natsuko Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring substrate with a reinforcing layer for preventing a warp
    Patent number: 8129626
    Abstract: A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semiconductor element is mounted; and a bonding surface to which external connection terminals are bonded. At least one of the insulating layers contains a glass cloth.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: March 6, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Natsuko Ueda, Yuji Yukiiri
  • MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20090236135
    Abstract: A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semiconductor element is mounted; and a bonding surface to which external connection terminals are bonded. At least one of the insulating layers contains a glass cloth.
    Type: Application
    Filed: March 6, 2009
    Publication date: September 24, 2009
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Natsuko UEDA, Yuji YUKIIRI