Patents by Inventor Nau Negishi

Nau Negishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8917315
    Abstract: An imaging module includes: a hollow lens holder open at both ends; a lens assembled in the lens holder and collecting light input from one end of the lens holder; a hollow imaging holder having an opening into which the light output from the lens is input; an optical member assembled in the imaging holder and transmitting or deflecting the light input from one end of the imaging holder; and an image sensor assembled in the imaging holder and having a light-receiving region configured to receive the light transmitted or deflected by the optical member and to perform photoelectric conversion of the received light, wherein an optical axis center of the lens and a center of the light received by the light-receiving region of the image sensor are aligned with each other by fitting a light-output-side end portion of the lens holder and the imaging holder to each other.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: December 23, 2014
    Assignee: Olympus Corporation
    Inventor: Nau Negishi
  • Patent number: 8513536
    Abstract: An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire being exposed in stages. The core wire and the shielded wire of the coaxial cable are directly connected to the first electrode and the second electrode that are exposed at a predetermined cable connecting surface of the electronic component.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: August 20, 2013
    Assignee: Olympus Corporation
    Inventors: Nau Negishi, Mikio Nakamura
  • Patent number: 8298008
    Abstract: In a cable assembly including signal lines formed by core wires, inner insulating bodies, outer conducting bodies, and outer insulating bodies, respectively, the signal lines in the cable assembly are formed in a manner of exposing respective outer conducting bodies from respective outer insulating bodies in an area at least including respective distal edges, an array block fixes the signal lines in a state where side surfaces of neighboring outer conducting bodies among the exposed outer conducting bodies are in contact, and a core wire electrode part and an outer conducting body electrode part which is connected to a part of edge faces of the plurality of outer conducting bodies fixed in the state where the side surfaces are in contact are formed on a circuit board to be connected to the cable assembly.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: October 30, 2012
    Assignee: Olympus Corporation
    Inventor: Nau Negishi
  • Publication number: 20120149238
    Abstract: In a cable assembly including signal lines formed by core wires, inner insulating bodies, outer conducting bodies, and outer insulating bodies, respectively, the signal lines in the cable assembly are formed in a manner of exposing respective outer conducting bodies from respective outer insulating bodies in an area at least including respective distal edges, an array block fixes the signal lines in a state where side surfaces of neighboring outer conducting bodies among the exposed outer conducting bodies are in contact, and a core wire electrode part and an outer conducting body electrode part which is connected to a part of edge faces of the plurality of outer conducting bodies fixed in the state where the side surfaces are in contact are formed on a circuit board to be connected to the cable assembly.
    Type: Application
    Filed: February 22, 2012
    Publication date: June 14, 2012
    Applicant: OLYMPUS CORPORATION
    Inventor: Nau NEGISHI
  • Publication number: 20110127079
    Abstract: An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire being exposed in stages. The core wire and the shielded wire of the coaxial cable are directly connected to the first electrode and the second electrode that are exposed at a predetermined cable connecting surface of the electronic component.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 2, 2011
    Applicant: OLYMPUS CORPORATION
    Inventors: Nau NEGISHI, Mikio NAKAMURA