Abstract: A system for providing electrical power connection across components mounted to a backplane of an electrical chassis includes a backplane having multiple apertures and front and rear faces. A daughter board faces the front face of the backplane. The daughter board has multiple traces with individual conductive pads. A power connector connected to the rear face of the backplane has multiple conductive members. Multiple fasteners each extend through both the daughter board and into the backplane to electrically couple each of the conductive pads of the daughter board to one of the conductive members of the power connector.

Abstract: A USB receptacle assembly includes a USB receptacle. The receptacle has a first end and a second end opposite the first end. The USB receptacle also includes a USB interface located at the first end. A riser is coupled to the second end of the USB receptacle and is generally perpendicular to a long axis of the USB receptacle. A board connector is coupled to the riser in electrical communication with the USB receptacle.

Abstract: A USB receptacle assembly includes a USB receptacle. The receptacle has a first end and a second end opposite the first end. The USB receptacle also includes a USB interface located at the first end. A riser is coupled to the second end of the USB receptacle and is generally perpendicular to a long axis of the USB receptacle. A board connector is coupled to the riser in electrical communication with the USB receptacle.

Abstract: A power distribution unit may include a power distribution unit frame, where the power distribution unit frame has a 2U form factor, and where the power distribution unit frame is coupled to mount in an embedded computer frame. A plurality of power ingress sites may be coupled to a rear portion of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin coupled to interface with an ingress in-line, hyperboloid radial socket, and where the power distribution unit has a current capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.

Abstract: An acoustic noise suppression device may include exhaust chambers adapted to interface with at least one exhaust port of an embedded computer chassis, where the exhaust port passes cooling air from at least one exhaust fan; a v-shaped deflector adapted to divide and direct the cooling air to the plurality of exhaust chambers; and noise suppression media coupled to the plurality of exhaust chambers, where the noise suppression media modifies a flow vector of the cooling air, and where the acoustic noise suppression device decreases a sound level created by the at least one exhaust fan.

Abstract: A power distribution unit (306) may include a power distribution unit frame (310), where the power distribution unit frame has a 2U form factor (312), and where the power distribution unit frame is coupled to mount in an embedded computer frame (102). A plurality of power ingress sites (330) may be coupled to a rear portion (320) of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin (332) coupled to interface with an ingress in-line, hyperboloid radial socket (334), and where the power distribution unit has a current-capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.

Abstract: A connector adaptor (205) and method may include a terminal block (210) and a power conductor (215). The power conductor includes in-line, hyperboloid radial sockets (220) to be applied to pins 235 mounted in an array on a power distribution unit (106), and two-hole terminal connectors 225, where the two-hole terminal connectors are each coupled to a pair of threaded studs (230) extending from the terminal block, and where the connector adaptor is adapted to conduct power to an embedded computer chassis.

Abstract: A method of monitoring a power distribution unit (306) may include providing a power distribution unit frame (310), where the power distribution unit frame has a 2U form factor (312), and where the power distribution unit frame is coupled to mount in an embedded computer frame (102). An alarm module (418) may be coupled to a circuit breaker connection site (214) in the power distribution unit frame. The alarm module may detect whether a circuit breaker (416) is coupled to the circuit breaker connection site via a set of auxiliary contacts (439). If the alarm module detects the circuit breaker, the alarm module monitors a set of shelf conditions. If the alarm module fails to detect the circuit breaker, the alarm module does not monitor the set of shelf conditions.

Abstract: An integrated power supply air inlet unit (124) coupled to slidably insert into a first interspace region (120) of an embedded computer chassis (100), where the first interspace region is defined by a module portion (102), a rear surface (110) and a first side surface (112), includes a power supply (128) coupled to supply power to the embedded computer chassis, and a front surface (130) that is substantially perpendicular to the first side surface. A cooling air mass (140) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular (150) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.

Abstract: A number of modules mechanically and electrically connect to each other to form an interconnecting module system. A latching mechanism connects each of the modules together. There is a backplane in each of the modules. The backplanes are interconnected When the modules are interconnected to each other. In addition, the modules can be stacked on top of each other and on top of a base. The base provides stability and support for the stack of modules.