Abstract: A power distribution unit (306) may include a power distribution unit frame (310), where the power distribution unit frame has a 2U form factor (312), and where the power distribution unit frame is coupled to mount in an embedded computer frame (102). A plurality of power ingress sites (330) may be coupled to a rear portion (320) of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin (332) coupled to interface with an ingress in-line, hyperboloid radial socket (334), and where the power distribution unit has a current-capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.

Abstract: A method of monitoring a power distribution unit (306) may include providing a power distribution unit frame (310), where the power distribution unit frame has a 2U form factor (312), and where the power distribution unit frame is coupled to mount in an embedded computer frame (102). An alarm module (418) may be coupled to a circuit breaker connection site (214) in the power distribution unit frame. The alarm module may detect whether a circuit breaker (416) is coupled to the circuit breaker connection site via a set of auxiliary contacts (439). If the alarm module detects the circuit breaker, the alarm module monitors a set of shelf conditions. If the alarm module fails to detect the circuit breaker, the alarm module does not monitor the set of shelf conditions.

Abstract: An integrated power supply air inlet unit (124) coupled to slidably insert into a first interspace region (120) of an embedded computer chassis (100), where the first interspace region is defined by a module portion (102), a rear surface (110) and a first side surface (112), includes a power supply (128) coupled to supply power to the embedded computer chassis, and a front surface (130) that is substantially perpendicular to the first side surface. A cooling air mass (140) is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular (150) to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.