Patents by Inventor Nauman Arshad

Nauman Arshad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tamper respondent module
    Patent number: 8687371
    Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: April 1, 2014
    Assignee: DY 4 Systems Inc.
    Inventors: Nauman Arshad, Jing Kwok, Ivan Straznicky, Martin Terence Cassels
  • Tamper respondent module
    Patent number: 8325486
    Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: December 4, 2012
    Assignee: Dy 4 Systems Inc.
    Inventors: Nauman Arshad, Jing Kwok, Ivan Straznicky, Martin Terence Cassels
  • TAMPER RESPONDENT MODULE
    Publication number: 20100177487
    Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.
    Type: Application
    Filed: January 13, 2010
    Publication date: July 15, 2010
    Inventors: Nauman Arshad, Jing Kwok, Ivan Straznicky, Martin Terence Cassels