Patents by Inventor Nava Shpaisman

Nava Shpaisman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220136113
    Abstract: A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 5, 2022
    Applicant: Kateeva, Inc.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Publication number: 20220104360
    Abstract: A method for preparing a PCB product having highly dense conductors, the method including providing a PCB substrate including a conductive layer, employing an inkjet printer to selectively print unexposed photosensitive patterns on the PCB substrate, the unexposed photosensitive patterns having a thickness of less than 5 pm, exposing the photosensitive patterns to radiation thereby to define exposed patterns, the exposed patterns having a pitch less than 20 pm and wet etching the conductive layer in accordance with a pattern defined by the exposed patterns thereby to define the highly dense conductors having a pitch of less than 30 pm.
    Type: Application
    Filed: February 11, 2020
    Publication date: March 31, 2022
    Inventors: Nava Shpaisman, Abraham Gross, Arie Glazer
  • Patent number: 11255018
    Abstract: A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: February 22, 2022
    Assignee: KATEEVA, LTD.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Publication number: 20210227696
    Abstract: A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material.
    Type: Application
    Filed: April 2, 2021
    Publication date: July 22, 2021
    Applicant: KATEEVA, INC.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Patent number: 11006528
    Abstract: A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: May 11, 2021
    Assignee: KATEEVA, INC.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Publication number: 20210007225
    Abstract: A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 7, 2021
    Applicant: Kateeva, Inc.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Publication number: 20200396842
    Abstract: Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include depositing a first aqueous composition comprising a first reactive component onto a metallic layer of a substrate; depositing a second aqueous composition comprising a second reactive component on selected portions of the deposited first aqueous composition to form, from a chemical reaction between the first reactive component and the second reactive component, a bi-component material mask in a pattern to protect selected regions of the metallic layer; and depositing an etch solution to remove the metallic layer in regions not protected by the bi-component material mask.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 17, 2020
    Applicant: Kateeva, Inc.
    Inventors: Moshe FRENKEL, Nava SHPAISMAN
  • Patent number: 10806035
    Abstract: A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface- activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch resist mask.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 13, 2020
    Assignee: KATEEVA, INC.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Patent number: 10743420
    Abstract: Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include applying a composition comprising a first reactive component onto a metallic surface to form a primer layer; and image-wise printing by a nonimpact printing process on the primer layer another composition comprising a second reactive component to produce an etch-resist mask, wherein when droplets of the second composition contact the primer layer, the reactive components undergo a chemical reaction so as to immobilize the droplets. The set may include a first liquid composition comprising a fixating reactive component and a second liquid composition comprising an etch-resist reactive component, wherein the fixating reactive component and the fixating reactive component are capable undergoing a chemical reaction to form a bi-component material that is insoluble in water and in an acidic etch solution.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: August 11, 2020
    Assignee: Kateeva, Inc.
    Inventors: Moshe Frenkel, Nava Shpaisman
  • Publication number: 20190335589
    Abstract: A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material.
    Type: Application
    Filed: July 10, 2019
    Publication date: October 31, 2019
    Applicant: Kateeva, Inc.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Patent number: 10398034
    Abstract: A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: August 27, 2019
    Assignee: Kateeva, Inc.
    Inventors: Nava Shpaisman, Moshe Frenkel
  • Patent number: 10105467
    Abstract: Biodegradable, bioabsorbable cross-linked polymer tissue scaffolds for filling a void in human or animal soft tissue, such as a surgical or other wound, are disclosed. Drugs incorporated into the polymer backbone and/or loaded into the matrix are released directly to the target site. Additional non-toxic chemical constituents can be used to tune the hydrophilio hydrophobic and other physical properties of the cross-linked polymer tissue scaffolds, and incorporating brominated or iodinated constituents provides radio-opacity. The radio-opaque cross-linked polymer tissue scaffolds can assist in the targeting of radiation therapy.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: October 23, 2018
    Assignee: RUTGERS, THE STATE UNIVERSITY OF NEW JERSEY
    Inventors: Joachim B. Kohn, Atif J. Khan, Nava Shpaisman
  • Publication number: 20180242457
    Abstract: A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface- activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch resist mask.
    Type: Application
    Filed: July 27, 2016
    Publication date: August 23, 2018
    Inventors: Nava SHPAISMAN, Moshe FRENKEL
  • Publication number: 20180192521
    Abstract: A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material.
    Type: Application
    Filed: December 7, 2017
    Publication date: July 5, 2018
    Inventors: Nava SHPAISMAN, Moshe FRENKEL
  • Publication number: 20180146556
    Abstract: Methods and composition sets for forming etch-resist masks on a metallic surface are provided. The method may include applying a composition comprising a first reactive component onto a metallic surface to form a primer layer; and image-wise printing by a nonimpact printing process on the primer layer another composition comprising a second reactive component to produce an etch-resist mask, wherein when droplets of the second composition contact the primer layer, the reactive components undergo a chemical reaction so as to immobilize the droplets. The set may include a first liquid composition comprising a fixating reactive component and a second liquid composition comprising an etch-resist reactive component, wherein the fixating reactive component and the fixating reactive component are capable undergoing a chemical reaction to form a bi-component material that is insoluble in water and in an acidic etch solution.
    Type: Application
    Filed: June 2, 2016
    Publication date: May 24, 2018
    Applicant: Jet Cu Pcb Ltd.
    Inventors: Moshe FRENKEL, Nava SHPAISMAN
  • Publication number: 20150335783
    Abstract: Biodegradable, bioabsorbable cross-linked polymer tissue scaffolds for filling a void in human or animal soft tissue, such as a surgical or other wound, are disclosed. Drugs incorporated into the polymer backbone and/or loaded into the matrix are released directly to the target site. Additional non-toxic chemical constituents can be used to tune the hydrophilio hydrophobic and other physical properties of the cross-linked polymer tissue scaffolds, and incorporating brominated or iodinated constituents provides radio-opacity. The radio-opaque cross-linked polymer tissue scaffolds can assist in the targeting of radiation therapy.
    Type: Application
    Filed: January 22, 2014
    Publication date: November 26, 2015
    Applicant: RUTGERS, THE STATE UNIVERSITY OF NEW JERSEY
    Inventors: Joachim B. Kohn, Atif J. Khan, Nava Shpaisman