Patents by Inventor Navneet Kumar SINGH, I

Navneet Kumar SINGH, I has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DOUBLE-SIDED ULTRA SLIM MODULE CONNECTOR
    Publication number: 20230299516
    Abstract: A back-to-back ultra-slim module (USM) includes an inline USM (USMi) connector and a top mount USM (USMt) connector. The back-to-back USM assembly can be made as a double-sided module to allow a stacked module configuration to save system area. The stacked module has a USMi module inline with the system board on one side of the system board, and a USMt module vertically offset from the other side of the system board. The stacked module can have a thermal layer between the USMi module and the USMt module.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Applicant: Intel Corporation
    Inventors: Amarjeet KUMAR, Navneet Kumar SINGH, I, Samarth ALVA, Richard S. PERRY, Christopher WEST