Abstract: Examples described herein relate to hot page detection. Some examples include circuitry to provide a number of pages with access counts within a bucket of a histogram, wherein the bucket of the histogram is associated with a configured access count range; based on a distribution of access counts in the histogram being a first level, reduce the configured access count ranges of the different buckets of the histogram; determine a second level indicative of page access counts; and migrate data of pages from a far memory to a near memory based on the second level.

Abstract: Locking hardware is provided in association with a shared memory. A first lock request is received at the locking hardware from a first host device to lock a portion of the shared memory and a first lock is assigned to the first host device by the locking hardware to provide the first host device exclusive access to the portion of the shared memory. A second request is received from an independent, second host device to lock the portion of the shared memory and is queued by the locking hardware while the first lock is assigned to the first host device. After the first lock is released, the locking hardware assigns a second lock to the second host device based on the second request.

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

Abstract: An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.

Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.

Abstract: An electronic device or a component thereof is described, which may include communication and/or thermal interconnects. The device may include hingedly coupled portions, where the interconnects are axially arranged (e.g., coincident) with respect to a hinge axis of the foldable electronic device.

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass, and buildup layers over the first substrate. In an embodiment, a first die is over the buildup layers, a second die is over the buildup layers and adjacent to the first die, and where conductive routing in the buildup layers electrically couples the first die to the second die.

Abstract: Capacitors are commonly used in design and manufacturing of PCBs, which may exhibit a vibration effect, such as a piezoelectric effect. This vibration may induce acoustic noise. PCB capacitor-induced acoustic noise mitigation may include receiving an AC input that is converted and applied to a voltage rail, which may be used by first capacitor set. An additional capacitor set may receive and invert the voltage rail signal and oscillate (e.g., vibrate) out of phase with the first capacitor set, such that the second capacitor set mitigates or cancels the acoustic noise generated by the first capacitor set.

Abstract: An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.

Abstract: The present disclosure provides binding proteins, such as antibodies and antigen-binding fragments, which specifically bind to human CD96 receptor protein (hu-CD96) and are capable of decreasing, inhibiting, and/or fully-blocking immune regulatory effects mediated by hu-CD96. The present disclosure also provides methods of using the antibodies (and compositions thereof) to treat diseases and conditions responsive to decreasing, inhibiting and/or blocking immune regulatory function or activity mediated by CD96 binding to CD155, including effects arising from CD96 interactions with CD226 and/or TIGIT.

Abstract: The present disclosure provides binding proteins, such as antibodies and antigen-binding fragments, which specifically bind to human CD96 receptor protein (hu-CD96) and are capable of decreasing, inhibiting, and/or fully-blocking immune regulatory effects mediated by hu-CD96. The present disclosure also provides methods of using the antibodies (and compositions thereof) to treat diseases and conditions responsive to decreasing, inhibiting and/or blocking immune regulatory function or activity mediated by CD96 binding to CD155, including effects arising from CD96 interactions with CD226 and/or TIGIT.

Abstract: Apparatus, systems, and articles of manufacture for separable electronic devices are disclosed. A separable electronics device includes a first panel having a first zipper component, the first panel including a front housing, display cover glass, a display panel, display electronics, and a first panel-panel interface. The separable electronics device further includes a second panel having a second zipper component, the second panel including a back housing, and a second panel-panel interface, wherein the first panel and the second panel are physically coupled by a mechanical connection of the first zipper component and the second zipper component.

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

Abstract: A method is described. The method includes determining that a memory page is in one of an active state and an idle state from meta data that is maintained for the memory page. The method includes recording a past history of active/idle state determinations that were previously made for the memory page. The method includes training a neural network on the past history of the memory page. The method includes using the neural network to predict one of a future active state and future idle state for the memory page. The method includes determining a location for the memory page based on the past history of the memory page and the predicted future state of the memory page, the location being one of a faster memory and a slower memory. The method includes moving the memory page to the location from the other one of the faster memory and the slower memory.

Abstract: A circuit assembly for installation in a laptop lid is disclosed. The assembly includes a plurality of connectors for wired communication with a base of a laptop, and an Rf connector for wired Rf communication with the base.

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example electronic device disclosed herein includes a housing, a fan, a first sensor, a second sensor, and a processor to at least one of analyze first sensor data generated by the first sensor to detect a presence of a subject proximate to the electronic device or analyze second sensor data generated by the second sensor to detect a gesture of the subject, and adjust one or more of an acoustic noise level generated the fan or a temperature of an exterior surface of the housing based on one or more of the presence of the subject or the gesture.

Abstract: The present application describes a Cold Rolling Mill (CRM) 200. The CRM 200 comprises a pair of working rolls 202 configured to apply stress on a metal strip for reducing thickness of the metal strip. The pair of working rolls 202 have a face width of 1350 mm. The CRM 200 further comprises a pair of intermediate rolls 204 configured to provide mechanical support to the pair of working rolls 202. The pair of intermediate rolls 204 have a face width of 1280 mm. The CRM 200 further comprises a pair of back-up rolls 206 configured to provide mechanical support to the pair of intermediate rolls 204. The back-up rolls 206 have a face width of 1300 mm. Bearing center distance of the CRM 200 is 2170 mm.

Abstract: The present disclosure provides binding proteins, such as antibodies and antigen-binding fragments, which specifically bind to human CD96 receptor protein (hu-CD96) and are capable of decreasing, inhibiting, and/or fully-blocking immune regulatory effects mediated by hu-CD96. The present disclosure also provides methods of using the antibodies (and compositions thereof) to treat diseases and conditions responsive to decreasing, inhibiting and/or blocking immune regulatory function or activity mediated by CD96 binding to CD155, including effects arising from CD96 interactions with CD226 and/or TIGIT.

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example electronic device disclosed herein includes a housing, a fan, a first sensor, a second sensor, and a processor to at least one of analyze first sensor data generated by the first sensor to detect a presence of a subject proximate to the electronic device or analyze second sensor data generated by the second sensor to detect a gesture of the subject, and adjust one or more of an acoustic noise level generated the fan or a temperature of an exterior surface of the housing based on one or more of the presence of the subject or the gesture.