Abstract: An optical module with a cooling system provides enhanced heat removal using one or more passive cooling devices. Such passive cooling devices include a protrusion through the housing of the optical module that thermally couples a heat-generating component in the optical module to a heat-sink module; a PGS material configured to form wetted contact with adjacent surfaces and therefore provide greater thermal conductivity; and one or more heat pipes configured to thermally couple a heat-generating component in the optical module to a remote heat-sink.

Abstract: A plurality of memory lies within the airflow created by the cooling fans and includes modules arranged in a plurality of pairs of memory modules aligned in substantially the same direction as airflow. Each pair has a first memory module and a second memory module, the first and second memory modules each have a length, and the first memory module and the second module are disposed such that the length of the first memory module is in a substantially parallel relationship with respect to the length of the second memory module. A portion of the length of the first memory module is disposed between another pair of memory modules.

Abstract: A mask for covering a substrate for performing capacitance-voltage measurements on the substrate is a full-faced mask covering substantially all of the substrate and having a thin outer section and a thicker inner section, so that the outer section is thin enough to permit desired clearance tolerances when inserting the substrate/mask assembly into or removing it from a cassette, and the inner section is thick enough to provide structural stability to the mask to ensure proper contact between the mask and the test substrate. The mask may include a ring with one or more strips across the ring with holes in the strips for target material deposition. In an alternative embodiment, the mask may be a disk with holes at various locations across the disk. In either embodiment, the mask generally conforms to the shape of the substrate, so that the clamp ring of the PVD chamber seats on the mask or on the substrate, so little or none of the plasma or sputtered material can escape between the substrate and clamp ring.

Abstract: A mask for covering a substrate for performing capacitance-voltage measurements on the substrate is a full-faced mask covering substantially all of the substrate. The mask may include a ring with one or more strips across the ring with holes in the strips for target material deposition. In an alternative embodiment, the mask may be a disk with holes at various locations across the disk. In either embodiment, the mask generally conforms to the shape of the substrate, so that the clamp ring of the PVD chamber seats on the mask or on the substrate, so little or none of the plasma or sputtered material can escape between the substrate and clamp ring. Various embodiments of the mask provide different ways to hold the mask on the substrate, such as clamping with clips, gluing with an adhesive, folding extensions of the mask over the edge of the substrate, and holding by surface tension.