Abstract: In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.

Abstract: In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.

Abstract: Micro-nano hybrid composites exhibiting desirable thermal conductivity levels due to the presence of specific ratios of graphite to graphene that have been found to reduce the overall thermal interface resistance. The composites are preferably epoxy matrix composites in some embodiments. Devices including the composites and methods of preparing the composites are also disclosed.

Abstract: The electronic package includes a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers; wherein the substrate further includes a plurality of thermal finned vias that electrically connect the conductive routings within the substrate to one another; and an electronic component mounted on the substrate, wherein the finned via transfers heat from the electronic component to the substrate and electrically connects the conductive routings within the substrate to the electronic component.

Abstract: The electronic package includes a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers; wherein the substrate further includes a plurality of thermal finned vias that electrically connect the conductive routings within the substrate to one another; and an electronic component mounted on the substrate, wherein the finned via transfers heat from the electronic component to the substrate and electrically connects the conductive routings within the substrate to the electronic component.

Abstract: Micro-nano hybrid composites exhibiting desirable thermal conductivity levels due to the presence of specific ratios of graphite to graphene that have been found to reduce the overall thermal interface resistance. The composites are preferably epoxy matrix composites in some embodiments. Devices including the composites and methods of preparing the composites are also disclosed.