Abstract: An antenna package according to an embodiment of the present disclosure includes a first antenna device including a first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the first circuit board, a second antenna unit integrated with the second circuit board, and an antenna driving integrated circuit chip mounted on the second circuit board and electrically connected to the first antenna unit and the second antenna unit. Multi-axial radiation is implemented using the antenna package with high efficiency and reliability.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, a first circuit board including a first core layer having a first surface and a second surface opposite to each other, a signal wiring extending on the first surface of the first core layer to be electrically connected to the antenna unit, and a first via structure penetrating through the first core layer, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the antenna unit and the first via structure.

Abstract: The present disclosure relates to a conventional cigarette with a heating structure similar to that of heated tobacco by providing a heat source portion that uses a chemical reaction, and provides a cigarette stick to which an ignition system is attached and that may be fired regardless of environmental conditions of a smoking place to improve convenience of a consumer.

Abstract: A porous aramid nanofiber film, a manufacturing method thereof, and a secondary battery including the same are provided. The method of manufacturing the porous aramid nanofiber film includes forming an aramid nanoseed suspension layer by applying an aramid nanoseed suspension on a substrate. The suspension layer is immersed in an alcohol-containing protic solvent for first solvent exchange to prepare an aramid nanofiber film by self-assembly. The aramid nanofiber film is immersed in water for second solvent exchange to form an aramid nanofiber hydrogel film. Freeze-drying the aramid nanofiber hydrogel film to prepare a porous aramid nanofiber film.

Abstract: A circuit board for an antenna includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer, and a conductive layer disposed on the second surface of the core layer to cover the signal wiring in a plan view. The conductive layer has a slit portion formed around the signal wiring in the plan view.

Abstract: A circuit board for an antenna according to an embodiment includes a core layer having a first surface and second surface that face each other, a second conductive layer disposed on the second surface of the core layer, and a first conductive layer disposed on the first surface of the core layer. The first conductive layer includes signal wirings, and a co-planar ground spaced apart from the signal wirings in a horizontal direction. The co-planar ground includes a first recess formed between end portions of neighboring signal wirings of the signal wirings.

Abstract: Disclosed is a method for operating and participating in a voice chat room subordinate to a message chat room is disclosed. The method for operating a voice chat room subordinate to a message chat room includes: managing, by a server, messages transmitted and received through the message chat room in which a first user and a second user participate; receiving, by the server, a request for creation of the voice chat room subordinate to the message chat room from the first user; creating, by the server, the voice chat room in response to the received request for creation of the voice chat room; providing, by the server, information that the voice chat room is being operated to the second user through the message chat room; providing, by the server, information that the voice chat room is being operated to the second user through a message chat room list.

Abstract: An antenna structure according to an embodiment includes an antenna device, a circuit board connected to the antenna device and including an inner insulation layer, and an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board. A portion of the inner insulation layer covered by the outer insulation layer may have a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a flexible circuit board electrically connected to the antenna unit. The flexible circuit board has a bending area. The flexible circuit board includes a core layer having a first surface and a second surface facing each other, a signal wiring disposed on the first surface of the core layer and electrically connected to the antenna unit, a ground line disposed on the first surface of the core layer to be spaced apart from the signal wiring, a ground layer disposed on the second surface of the core layer, and a via structure penetrating a portion of the core layer in a region excluding the bending area and connecting the ground line and the ground layer with each other.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, and a first circuit board electrically connected to the antenna device. The first circuit board includes a first core layer, a first circuit wiring layer formed on one surface of the first core layer and electrically connected to the antenna unit, a first connector connected to an end portion of the first circuit wiring layer on the one surface of the first core layer, and a first shielding barrier disposed on the other surface opposite to the one surface of the first core layer. The first shielding barrier at least partially covers the first connector in a planar view.

Abstract: An antenna package includes an antenna device including an antenna dielectric layer and an antenna unit formed on the antenna dielectric layer, and an intermediate circuit board electrically connected to the antenna unit. The intermediate circuit board includes a core layer and a signal line formed on a surface of the core layer and electrically connected to the antenna unit. A width of one end portion of the signal line connected to the antenna unit is smaller than a width of the other end portion opposite to the one end portion of the signal line. Impedance mismatching is prevented by the construction of the signal line to improve antenna properties.

Abstract: An impedance converter for an antenna includes a first port receiving a power from an antenna driving integrated circuit, an impedance modulator connected to the first port to convert an impedance, and a second port connected to the modulator and configured to perform a feeding to an antenna unit. The second port has an impedance higher than that of the first port. Impedance mismatching is prevented by the impedance modulator to improve antenna properties.

Abstract: An antenna device according to an embodiment of the present invention includes a substrate layer, an antenna unit formed on a top surface of the substrate layer, a circuit wiring disposed on the top surface of the substrate layer and directly connected to the antenna unit, a stress compensation layer covering the circuit wiring on the top surface of the substrate layer and having a thickness greater than a thickness of the substrate layer, a first dielectric layer formed on a bottom surface of the substrate layer to overlap the circuit wiring in a planar view, and a first ground layer overlapping the circuit wiring in the planar view with the first dielectric layer or the stress compensation layer interposed therebetween.

Abstract: An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

Abstract: An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

Abstract: A circuit board according to an embodiment includes a first substrate including an antenna feeder line formed thereon to connect an antenna driving unit and an antenna, a second substrate including a data line formed thereon to transmit data processed in the antenna driving unit to an electronic component, and a third substrate which is disposed between the first substrate and the second substrate, and includes a power supply line formed thereon to supply a power to the antenna driving unit.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including a dielectric layer and an antenna unit disposed on the dielectric layer, and a circuit board. The antenna unit includes a radiator and a transmission line extending from the radiator. The circuit board includes a core layer and a signal wiring disposed on the core layer and electrically connected to the antenna unit. The circuit board has a bonding region adhered to the antenna device, a signal transmission region including the signal wiring and a connect region including a connector connected to a terminal end portion of the signal wiring. A length of the transmission line of the antenna unit is greater than or equal to a length of the signal transmission region of the circuit board.

Abstract: An antenna package includes an antenna device and a circuit board bonded to the antenna device. The circuit board includes a core layer, a feeding line formed on the core layer and bonded to the antenna device, and a CPW ground formed on the core layer to be physically separated from the feeding line and the antenna device.

Abstract: An antenna package according to an embodiment includes an antenna unit and a circuit board bonded to the antenna unit. The circuit board includes a core layer comprising a plurality of portions having different widths from each other in a planar view, the core layer having a first surface and a second surface opposing each other, and a circuit wiring disposed on the first surface of the core layer and electrically connected to the antenna unit.

Abstract: An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.