Abstract: Operational mode changes in a system-on-a-chip (SoC) integrated circuit in a complex device such as a mobile phone cause spikes in current demand which can cause voltage droops that disrupt operation of the SoC. A hybrid parallel power supply capacitively couples a switching-mode power supply and a low-dropout voltage regulator in parallel to provide high efficiency and fast response times. The low-dropout voltage regulator may include a class-AB operational transconductance amplifier driving the coupling capacitor. The switching-mode power supply and the low-dropout voltage regulator can regulate their outputs to slightly difference voltage levels. This can allow the switching-mode power supply to supply most of the SoC's current demands.

Abstract: Operational mode changes in a system-on-a-chip (SoC) integrated circuit in a complex device such as a mobile phone cause spikes in current demand which can cause voltage droops that disrupt operation of the SoC. A hybrid parallel power supply connects a switching-mode power supply and a low-dropout voltage regulator in parallel to provide high efficiency and fast response times. Integration of the voltage regulator on the SoC reduces parasitic impedance be between the voltage regulator and the load to aid in reducing voltage droops. The switching-mode power supply and the low-dropout voltage regulator can regulate their outputs to slightly difference voltage levels. This can allow the switching-mode power supply to supply most of the SoC's current demands.

Abstract: Operational mode changes in a system-on-a-chip (SoC) integrated circuit in a complex device such as a mobile phone cause spikes in current demand which can cause voltage droops that disrupt operation of the SoC. A hybrid parallel power supply capacitively couples a switching-mode power supply and a low-dropout voltage regulator in parallel to provide high efficiency and fast response times. The low-dropout voltage regulator may include a class-AB operational transconductance amplifier driving the coupling capacitor. The switching-mode power supply and the low-dropout voltage regulator can regulate their outputs to slightly difference voltage levels. This can allow the switching-mode power supply to supply most of the SoC's current demands.

Abstract: Operational mode changes in a system-on-a-chip (SoC) integrated circuit in a complex device such as a mobile phone cause spikes in current demand which can cause voltage droops that disrupt operation of the SoC. A hybrid parallel power supply connects a switching-mode power supply and a low-dropout voltage regulator in parallel to provide high efficiency and fast response times. Integration of the voltage regulator on the SoC reduces parasitic impedance be between the voltage regulator and the load to aid in reducing voltage droops. The switching-mode power supply and the low-dropout voltage regulator can regulate their outputs to slightly difference voltage levels. This can allow the switching-mode power supply to supply most of the SoC's current demands.

Abstract: Aspects of a method of manufacturing a capacitor are provided. The method includes layering a plurality of dielectric plates. The plurality of dielectric plates includes a first dielectric plate having a first conductive region and a second conductive region on a surface of the first dielectric plate. The method further includes forming an inner electrode through an axis of the layered plurality of dielectric plates. The inner electrode electrically couples to the first conductive region on the surface of the first dielectric plate. The method further includes forming an outer electrode, where the outer electrode electrically couples to the second conductive region on the surface of the first dielectric plate.

Abstract: A capacitor with low equivalent series inductance includes multiple electrode layers arranged in parallel with alternating ones of the electrode layers connected together to form the two electrodes of the capacitor. A first set of the electrode layers are connected by an outer wall. A second set of the electrode layers are connected by a central post. Terminals on the capacitor can be spaced on a surface so that signals can be conveniently routed when the capacitor is mounted on or in a printed circuit board or integrated circuit package. Terminals can be included on opposing surfaces of the capacitors to provide for stacking. Additionally, one of the terminals substantially surrounds the other terminal and can provide electromagnetic shielding.

Abstract: Embodiments and examples of differential threshold voltage non-volatile memories and related methods are described herein. Other embodiments, examples thereof, and related methods are also disclosed herein.

Abstract: Embodiments and examples of differential threshold voltage non-volatile memories and related methods are described herein. Other embodiments, examples thereof, and related methods are also disclosed herein.

Abstract: A non-iterative frequency domain method for the accurate and efficient simulation of nonlinear systems is presented. In one aspect of the present invention, simulating a nonlinear system is accomplished by first modeling the system and generating parameters that describe the nonlinear system. The system is represented in the frequency domain as an inverse convolution equation (ICE), comprising cascaded convolutions and frequency representations of known and unknown signals. Next, the order of the ICE is determined based upon the degree of nonlinearity in the system. Finally, a general ICE solver algorithm is adapted to the ICE order of the frequency model, and the specific ICE solver algorithm is applied to in order to solve for an unknown signal. In another aspect of the invention, the non-iterative method for simulating nonlinear systems is combined with cross-referenced coordinate (CRC) techniques in order to increase the computational efficiency of the simulation.

Abstract: A method and system of simulating components using a compressed signal representation. In some embodiments compressed vector based equivalent signals and blocks are used to model signal processing systems, in particular RF wireless components.