Abstract: Certain exemplary aspects of the present disclosure are directed towards an apparatus in which a base deck and a forged base deck cover are coupled to one another, via a weld joint, to provide a hermetically sealed cavity within. The base deck includes an outer region, and the base deck cover includes a lip that interfaces with the outer region of the base deck to provide the weld joint. Similarly, the base deck is formed by an outer region of a base deck bottom portion interfacing with a lip of the shroud to form, via welding, the base deck.

Abstract: Certain exemplary aspects of the present disclosure are directed towards an apparatus in which a base deck and a forged base deck cover are coupled to one another, via a weld joint, to provide a hermetically sealed cavity within. The base deck includes an outer region, and the base deck cover includes a lip that interfaces with the outer region of the base deck to provide the weld joint. Similarly, the base deck is formed by an outer region of a base deck bottom portion interfacing with a lip of the shroud to form, via welding, the base deck.

Abstract: An apparatus and associated methodology associated with a thermally conductive frame having a perimeter surface defining a passage. A printed circuit board assembly (PCBA) is operably disposed within the passage and connected to the frame. The PCBA includes a solid state memory component. An internal cover is disposed in the passage on one side of the PCBA. The internal cover conducts heat to the frame that is operably generated by the solid state memory component. An external cover is attachable to the frame on an opposing side of the PCBA. The external cover cooperates with the frame and the internal cover to enclose the PCBA.

Abstract: A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.

Abstract: A hermetic seal includes a spring seal compressed with a limited sealing force between sealing surfaces. The sealing surfaces surround a gas-filled cavity that houses heat sensitive components. The hermetic seal includes a film that joins the spring seal to the sealing surfaces. The film includes a material that is softenable by heat to hermetically seal the spring seal to the sealing surfaces. The hermetic seal includes an externally accessible surface for selectively application of the heat to the film, without overheating the heat sensitive components.

Abstract: The present invention is directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing with parallel mounting frames extending along the side edges of the circuit board. Each mounting frame has a body portion having a support shelf and an overhang ledge forming a channel, the channel nesting an associated side edge of the circuit board. A mounting peg is supported to extend transversely to the entry of the channel, and temporary deforming of the ledge permits entry of the associated side edge into the channel, the circuit board having a complementary peg retention hole appropriately sized to receive the mounting peg.

Abstract: A capacitor device and associated method having a housing made of a material that is folded to form a cavity sized to contain an electrolyte and electrode package. The material has a substrate and a film attached to the substrate. Respective portions of the film that are folded against each other are fused together to form a first seal that in cooperation with a folded edge of the material seals the cavity. The capacitor also has a second seal attached to the housing and to the first seal that seals the cavity.

Abstract: A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.

Abstract: An apparatus and associated methodology associated with a thermally conductive frame having a perimeter surface defining a passage. A printed circuit board assembly (PCBA) is operably disposed within the passage and connected to the frame. The PCBA includes a solid state memory component. An internal cover is disposed in the passage on one side of the PCBA. The internal cover conducts heat to the frame that is operably generated by the solid state memory component. An external cover is attachable to the frame on an opposing side of the PCBA. The external cover cooperates with the frame and the internal cover to enclose the PCBA.

Abstract: Various embodiments of the present invention are directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing that has first and second parallel elongated mounting frames extending along the respective side edges of the circuit board. Each mounting frame has an elongated body portion forming a channel extending the length of the body, the channel serving to nest one of the side edges of the circuit board. The body of each mounting frame has one or more sets of orthogonally disposed, intersecting mounting holes that permit use of mounting holes to accommodate screws for attaching the mounting frames in a rack frame of a host system so that the circuit board is optionally supported in a side attached mode or in a bottom attached mode.

Abstract: An actuator for supporting data transfer elements includes an arm, a flexible circuit assembly and a sensor. The flexible circuit assembly includes a stiffener having a mount feature and a turnaround feature. The flexible circuit assembly also includes a flexible cable having a plurality of conductive traces for electrically connecting the data transfer elements to circuitry. The flexible cable has a service loop portion, a mounting portion coupled to the mount feature of the stiffener and a turnaround portion coupled to the turnaround feature of the stiffener. The turnaround portion is configured to couple the mounting portion to the service loop portion. The sensor is in contact with a surface of the arm and is electrically coupled to the flexible cable.

Abstract: A capacitor device and associated method having a housing made of a material that is folded to form a cavity sized to contain an electrolyte and electrode package. The material has a substrate and a film attached to the substrate. Respective portions of the film that are folded against each other are fused together to form a first seal that in cooperation with a folded edge of the material seals the cavity. The capacitor also has a second seal attached to the housing and to the first seal that seals the cavity.

Abstract: The present invention is directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing with parallel mounting frames extending along the side edges of the circuit board. Each mounting frame has a body portion having a support shelf and an overhang ledge forming a channel, the channel nesting an associated side edge of the circuit board. A mounting peg is supported to extend transversely to the entry of the channel, and temporary deforming of the ledge permits entry of the associated side edge into the channel, the circuit board having a complementary peg retention hole appropriately sized to receive the mounting peg.

Abstract: Various embodiments are generally directed to an apparatus that provides an interconnection with efficient data signal throughput. In some embodiments, a controller printed circuit board (PCB) supports a controller integrated circuit (IC) and a support bracket. A memory PCB is supported by the support bracket in a spaced apart, parallel relation to the controller PCB. The memory PCB supports at least one memory IC and has an edge connector which engages the support bracket. A flex circuit is provided that interconnects the edge connector to an interposer positioned on the controller PCB between the respective areal extent of the controller PCB and the memory PCB to form a data signal path between the memory IC and the controller IC.

Abstract: Various embodiments of the present invention are directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing that has first and second parallel elongated mounting frames extending along the respective side edges of the circuit board. Each mounting frame has an elongated body portion forming a channel extending the length of the body, the channel serving to nest one of the side edges of the circuit board. The body of each mounting frame has one or more sets of orthogonally disposed, intersecting mounting holes that permit use of mounting holes to accommodate screws for attaching the mounting frames in a rack frame of a host system so that the circuit board is optionally supported in a side attached mode or in a bottom attached mode.

Abstract: A channel senses head-to-disc contact vibrations in a vibrational noise spectrum produced in a mass storage device. The channel includes a suspension system with a suspension modal resonance. The channel includes a vibration sensor that senses head-to-disc contact vibrations through the suspension system. The vibration sensor has a sensor modal resonance that overlaps the suspension modal resonance.

Abstract: A media separator plate is provided having a plate main body and a shroud. The plate main body has a continuous, non-interrupted inner circumference and a continuous, non-interrupted outer circumference. The plate main body extends from the inner circumference to the outer circumference and includes a top surface and a bottom surface. The shroud is integrally formed with at least a portion of the outer circumference of the plate main body. The shroud is configured to at least partially surround the plate main body. The shroud extends above the top surface of the plate main body, below the bottom surface of the plate main body and outwardly from the outer circumference of the plate main body.

Abstract: An actuator for supporting data transfer elements includes an arm, a flexible circuit assembly and a sensor. The flexible circuit assembly includes a stiffener having a mount feature and a turnaround feature. The flexible circuit assembly also includes a flexible cable having a plurality of conductive traces for electrically connecting the data transfer elements to circuitry. The flexible cable has a service loop portion, a mounting portion coupled to the mount feature of the stiffener and a turnaround portion coupled to the turnaround feature of the stiffener. The turnaround portion is configured to couple the mounting portion to the service loop portion. The sensor is in contact with a surface of the arm and is electrically coupled to the flexible cable.

Abstract: A hermetic seal includes a spring seal compressed with a limited sealing force between sealing surfaces. The sealing surfaces surround a gas-filled cavity that houses heat sensitive components. The hermetic seal includes a film that joins the spring seal to the sealing surfaces. The film includes a material that is softenable by heat to hermetically seal the spring seal to the sealing surfaces. The hermetic seal includes an externally accessible surface for selectively application of the heat to the film, without overheating the heat sensitive components.

Abstract: A hermetically sealed housing having a base deck, a cover member and a seal assembly constructed of a liquid crystal material (LCM), the base deck and cover member forming an enclosure containing an inert gas atmosphere. Various embodiments have the LCM seal bonded to one or both of the base deck and cover member and bonded to seal the enclosure by molding, compression, adhesive bonding, thermoplastic welding or soldering, or a combination of such.