Patents by Inventor Neal Jones Gors

Neal Jones Gors has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5959393
    Abstract: A surface mount assembly. The assembly includes an elongated sealed envelope, such as an incandescent lamp with a filament positioned in the envelope, first and second leads extending from the spaced ends of the envelope and a metal material applied to the second leads. The leads and metal are configured to form a pair of electrically conductive mounting members at the ends of the envelope for mounting the envelope to a circuit board.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: September 28, 1999
    Assignee: Miyakawa Corporation
    Inventors: Neal Jones Gors, William Franklin Redmond