Patents by Inventor Neal M. Bowen

Neal M. Bowen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked chip connection using stand off stitch bonding
    Patent number: 7021520
    Abstract: The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the second component and a third component such that the second wire bond is in electrical communication with the first wire bond, wherein the first and second wire bonds are connected to said first and second components, respectively, using ball bonding.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: April 4, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Neal M. Bowen
  • Stacked chip connection using stand off stitch bonding
    Publication number: 20030102358
    Abstract: The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the second component and a third component such that the second wire bond is in electrical communication with the first wire bond, wherein the first and second wire bonds are connected to said first and second components, respectively, using ball bonding.
    Type: Application
    Filed: December 5, 2001
    Publication date: June 5, 2003
    Inventor: Neal M. Bowen