Abstract: An optical interconnect includes a set of splitters. Each splitter includes a source waveguide, a reflection waveguide, an output waveguide, and a partially reflective mirror element with a reflective coating. The source waveguide and the reflection waveguide are optically coupled to the partially reflective element. A photonic signal from the source waveguide is partially reflected off the reflective coating as a reflected signal into the reflection waveguide. The output waveguide is optically coupled to the opposite surface and configured such that a non-reflected portion of the photonic signal propagates into the output waveguide. The reflective coating includes a reflected surface area interfacing with the photonic signal form the source waveguide, and power of the non-reflected portion is a function of the reflective surface area interfacing with source waveguide.

Abstract: An optical interconnect includes a set of splitters. Each splitter includes a source waveguide, a reflection waveguide, an output waveguide, and a partially reflective mirror element with a reflective coating. The source waveguide and the reflection waveguide are optically coupled to the partially reflective element. A photonic signal from the source waveguide is partially reflected off the reflective coating as a reflected signal into the reflection waveguide. The output waveguide is optically coupled to the opposite surface and configured such that a non-reflected portion of the photonic signal propagates into the output waveguide. The reflective coating includes a reflected surface area interfacing with the photonic signal form the source waveguide, and power of the non-reflected portion is a function of the reflective surface area interfacing with source waveguide.

Abstract: Methods for making a photonic guiding system for directing coherent light are disclosed. The methods include forming a channel in a host layer using at least one process of sawing, laser ablation, laser direct write of a photoresist, photo-structuring, and etching. A layer of highly reflective material is applied to substantially cover an interior of the channel. A cover having a layer of highly reflective material is coupled over the channel to form a large core hollow waveguide.

Abstract: This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

Abstract: Some embodiments provide identification of a first polyline and a second polyline associated with a differential signal, determination of whether a distance between a segment of the first polyline and a segment of the second polyline is within a first tolerance, determination, if the distance is not within the first tolerance, of whether the distance is within a second tolerance, determination, if the distance is not within the first tolerance and is within the second tolerance, of whether the length of the segment of the first polyline is less than a first threshold, and to indicate that the first polyline and the second polyline are sufficiently spaced, if the distance is not within the first tolerance and is within the second tolerance, and if the length of the segment of the first polyline is less than the first threshold.

Abstract: Some embodiments provide identification of a first polyline and a second polyline associated with a differential signal, determination of whether a distance between a segment of the first polyline and a segment of the second polyline is within a first tolerance, determination, if the distance is not within the first tolerance, of whether the distance is within a second tolerance, determination, if the distance is not within the first tolerance and is within the second tolerance, of whether the length of the segment of the first polyline is less than a first threshold, and to indicate that the first polyline and the second polyline are sufficiently spaced, if the distance is not within the first tolerance and is within the second tolerance, and if the length of the segment of the first polyline is less than the first threshold.

Abstract: This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.

Abstract: Some embodiments provide identification of a first polyline and a second polyline associated with a differential signal, determination of whether a distance between a segment of the first polyline and a segment of the second polyline is within a first tolerance, determination, if the distance is not within the first tolerance, of whether the distance is within a second tolerance, determination, if the distance is not within the first tolerance and is within the second tolerance, of whether the length of the segment of the first polyline is less than a first threshold, and to indicate that the first polyline and the second polyline are sufficiently spaced, if the distance is not within the first tolerance and is within the second tolerance, and if the length of the segment of the first polyline is less than the first threshold.

Abstract: Some embodiments provide identification of a first polyline and a second polyline associated with a differential signal, determination of whether a distance between a segment of the first polyline and a segment of the second polyline is within a first tolerance, determination, if the distance is not within the first tolerance, of whether the distance is within a second tolerance, determination, if the distance is not within the first tolerance and is within the second tolerance, of whether the length of the segment of the first polyline is less than a first threshold, and to indicate that the first polyline and the second polyline are sufficiently spaced, if the distance is not within the first tolerance and is within the second tolerance, and if the length of the segment of the first polyline is less than the first threshold.

Abstract: Some embodiments provide identification of a first polyline and a second polyline associated with a differential signal, determination of whether a distance between a segment of the first polyline and a segment of the second polyline is within a first tolerance, determination, if the distance is not within the first tolerance, of whether the distance is within a second tolerance, determination, if the distance is not within the first tolerance and is within the second tolerance, of whether the length of the segment of the first polyline is less than a first threshold, and to indicate that the first polyline and the second polyline are sufficiently spaced, if the distance is not within the first tolerance and is within the second tolerance, and if the length of the segment of the first polyline is less than the first threshold.

Abstract: A system to evaluate a distance between polyline segments includes identification of a first polyline and a second polyline associated with a differential signal, determination of whether a distance between a segment of the first polyline and a segment of the second polyline is within a first tolerance, and, if the distance is not within the first tolerance, determining whether the distance is within a second tolerance. If the distance is not within the first tolerance and is within the second tolerance, it is determined whether the length of the segment of the first polyline is less than a first threshold. If the distance is not within the first tolerance and is within the second tolerance, and if the length of the segment of the first polyline is less than the first threshold, it is indicated that the first polyline and the second polyline are sufficiently spaced.

Abstract: Determining a displacement of a substantially rigid item relative to a frame of reference between a first time and a second time is described. At the first time, a first set of pointwise measurements of a physical property of the item taken at a plurality of fixed locations relative to the frame of reference is acquired. At the second time, a second set of pointwise measurements of the physical property taken at the plurality of fixed locations is acquired. A first matrix derived from the first set of pointwise measurements is compared to a second matrix derived from the second set of pointwise measurements to determine the displacement.

Abstract: A method of manufacturing a nanowire filament includes forming and fusing actions. In a forming action, close proximity conductors are formed. In another forming action, a junction oxide is formed between the close proximity conductors. In a fusing action, a nanowire filament is fused between the close proximity conductors, through the junction oxide. A circuit is also provided, having first and second close proximity conductors, and a nanowire filament fused between the close proximity conductors.

Abstract: This invention relates to a semiconductor having protruding contacts comprising, a first semiconductor substrate having at least one interconnect located substantially within the first substrate, and a second semiconductor substrate having at least one protruding contact point that substantially contacts at least one interconnect.

Abstract: Some embodiments provide identification of a first polyline and a second polyline associated with a differential signal, determination of whether a distance between a segment of the first polyline and a segment of the second polyline is within a first tolerance, determination, if the distance is not within the first tolerance, of whether the distance is within a second tolerance, determination, if the distance is not within the first tolerance and is within the second tolerance, of whether the length of the segment of the first polyline is less than a first threshold, and to indicate that the first polyline and the second polyline are sufficiently spaced, if the distance is not within the first tolerance and is within the second tolerance, and if the length of the segment of the first polyline is less than the first threshold.

Abstract: This disclosure relates to a system and method for bonding an interconnect to a dense circuit device.

Abstract: Apparatus and method for making a multi-layered storage structure includes forming a device layer on a single-crystal wafer, cleaving the device layer from the wafer, repeating the forming and cleaving to provide a plurality of cleaved device layers, and bonding the cleaved device layers together to form the multi-layered storage structure.

Abstract: The invention includes an electronic memory structure. The electronic memory structure includes a substrate. A substantially planar first conductor is formed adjacent to the substrate. An interconnection layer is formed adjacent to the first conductor. A phase change material element is formed adjacent to the interconnection layer. The interconnection layer includes a conductive interconnect structure extending from the first conductor to the phase change material element. The interconnect structure includes a first surface physically connected to the first conductor. The interconnect structure further includes a second surface attached to the phase change material element. The second surface area of the second surface is substantially smaller than a first surface area of the first surface. A substantially planar second conductor is formed adjacent to the phase change material element.

Abstract: Apparatus and method for controlling establishment of telecommunications call connections in a telecommunications network. The network comprises a plurality of switches each with its own switching processor means, and a plurality of switching processing platforms each comprising at least one call processor. The switches and switching processing platforms are interconnected by a data network. SS7 signaling messages are received in one of the platforms and a call is assigned to a call processor. The call processor communicates with one or more switching processor means for controlling establishment of the call. Call features are processed under the control of the call processor. Advantageously, any call processor can be used for serving any call in the network and can control all legs of a multi-leg connection. Advantageously, in a large network, the number of platforms may be significantly less than the number of switches which reduces the cost and complexity of administration of the network.

Abstract: A double-sided electrical interconnect flexible circuit particularly useful for ink-jet pens and a method for assembling an ink-jet pen with the flexible circuit is described. A wide web, dielectric, flexible tape, such as of a polyimide material, is used to allow the substantially simultaneous formation of redundant flexible circuits across the web. The web is laminated with a conductive material foil and a plurality of redundant circuit patterns formed on the web in a single masking and etching process, or the like. A cover layer, also of a wide web format, dielectric material is coated over the circuit patterned conductive layer. Vias are provided in both the tape under layer and the tape over layer for appropriate electrical connections whereby a first device, such as an ink-jet printer controller, can be connected through one layer and a second device, such as a replaceable ink-jet pen's electrically active components can be connected through the other layer.