Abstract: An embodiment of an apparatus for retaining a substrate includes a base, a pair of arms positioned adjacent to a bottom surface of the base, the pair of arms including a first arm and a second arm, and an actuator coupled to the base and the pair of arms. The actuator is configured to move the pair of arms toward and away from one another along the bottom surface of the base. In addition, the apparatus includes a first plurality of retention pads positioned on the first arm in a first arrangement and a second plurality of retention pads positioned on the second arm in a second arrangement that is different from the first arrangement.

Abstract: Embodiments described herein relate to adhesive arrangements for waveguide devices, and related apparatus and methods. In one or more embodiments, the adhesive arrangements facilitate adhering strength, reduction and/or distribution of stress, withstanding of thermal cycles, and impact resistance. In one or more embodiments, a device includes a substrate and a lens coupled to the substrate using an adhesive. The substrates has a first face, a second face, and an outer edge. The first face of the substrate includes a waveguide, and the waveguide includes an input coupling grating, a pupil expansion grating, and an output coupling grating. The waveguide is disposed radially inwardly of the adhesive, and the device has an edge offset between an outer edge of the lens and the outer edge of the substrate.

Abstract: An ophthalmic lens is provided. The ophthalmic lens includes a lens stack having an eye-side (ES) lens, a world-side (WS) lens, a waveguide disposed between the ES lens and the WS lens, and one or more adhesive layers securing at least the ES lens to the waveguide and at least the WS lens to the waveguide. Further, the ophthalmic lens includes a retainer engaging the ES lens and the WS lens and being arranged to mechanically hold the lens stack together and resist delamination forces of the lens stack.

Abstract: Embodiments of the present disclosure relate to optical devices. More specifically, embodiments described herein have a lens stack including a waveguide, the lens stack having at least one surface partially coated with a hydrophobic and/or hydrophobic coating. In some embodiments, the hydrophobic and/or hydrophilic coatings are disposed over portions of the waveguide surface. In some embodiments, the hydrophobic and/or hydrophilic coatings are disposed over portions of the lens surfaces. In some embodiments, hydrophobic coatings prevent moisture from interacting with certain surfaces on the waveguide and hydrophilic coatings direct moisture away from those certain surfaces.

Abstract: In one or more embodiments, a display includes a waveguide. The waveguide includes a substrate with a first surface and a second surface. At least one grating is disposed over the first surface or the second surface. A first lens material is disposed over the first surface of the substrate. A first gap is defined by a lower surface of the first lens material and the first surface of the substrate. A second lens material is disposed over the second surface of the substrate. A second gap is defined by an upper surface of the second lens material and the second surface of the substrate. An adhesive composition includes at least a spacer. The adhesive composition is disposed between the first lens material and the first surface of the substrate, and the second lens material and the second surface of the substrate.

Abstract: Embodiments includes an ophthalmic lens and a method of forming the ophthalmic lens, as shown and described herein. The ophthalmic lens includes a waveguide, world-side (WS) lens, a WS adhesive securing the WS lens to the waveguide, a WS air gap between the WS lens and the waveguide, an eye-side (ES) lens, an ES adhesive securing the ES lens to the waveguide, and an ES air gap between the ES lens and the waveguide. The WS adhesive has a WS thickness and the WS air gap has a WS air gap distance. The WS air gap distance is greater than the WS adhesive thickness. The ES adhesive having an ES thickness and the ES air gap has an ES air gap distance. The ES air gap distance is greater than the WS adhesive thickness.

Abstract: Embodiments of the present invention relate to waveguide and methods of forming waveguides. The waveguide includes a waveguide stack including a waveguide substrate having a top surface and a bottom surface, a first low index layer disposed on the top surface, a first cap layer disposed on the first low index layer, a first lens disposed on the first cap layer, and a first optically clear adhesive layer between the first low index layer and the first lens. In another embodiment, a method of forming a waveguide is provided. The method includes dispensing a liquid optically clear adhesive layer on a lens, placing a waveguide stack including a first low index layer onto the liquid optically clear adhesive opposite the lens, and curing the liquid optically clear adhesive. The waveguide stack further includes a first cap layer disposed on the first low index layer.

Abstract: An embodiment of an apparatus for retaining a substrate includes a base, a pair of arms positioned adjacent to a bottom surface of the base, the pair of arms including a first arm and a second arm, and an actuator coupled to the base and the pair of arms. The actuator is configured to move the pair of arms toward and away from one another along the bottom surface of the base. In addition, the apparatus includes a first plurality of retention pads positioned on the first arm in a first arrangement and a second plurality of retention pads positioned on the second arm in a second arrangement that is different from the first arrangement.

Abstract: Embodiments of the present disclosure generally relate to a device with a substrate with a first surface, a second surface, and an edge where the first surface of the substrate includes a waveguide, where the waveguide includes an input coupling grating, a pupil expansion grating, and an output coupling grating. The device additionally includes a cover substrate, a blackening section disposed over the first surface between the edge of the substrate and the waveguide, and a gap between the substrate and the cover substrate. A method includes disposing blackening material over the substrate, placing a cover substrate on the blackening material and curing to form a blackening section. Another method includes disposing blackening material over the substrate, curing the blackening material to form a blackening section, disposing adhesive over the blackening section, curing the adhesive, and placing a cover substrate on the adhesive.

Abstract: A tray for carrying workpieces, such as optical waveguides, is disclosed. The tray includes a plurality of openings, each opening having a plurality of fingers extending toward the center of the opening. The top surface of each finger is sloped downward and comprises an elastomer. In this way, the workpieces contact the fingers along their edges and any nanostructures disposed on the workpiece are not contacted. Further, in some embodiments, the tray is stackable and includes a retention mechanism located on the bottom side of the tray. The retention mechanism on a first tray serves to secure the workpiece disposed on a second tray positioned directly below the first tray. The tray may optionally be used for shipping and other purposes.

Abstract: Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to apparatuses and methods for gripping optical devices. In an embodiment, an apparatus for gripping an optical device includes a base coupled to a proximal end of a stem extending from a bottom surface of the base. The apparatus also includes a plurality of arms movably coupled to the bottom surface of the base. The plurality of arms are coupled to an actuator operable to move the plurality of arms laterally along a X-Y plane parallel to the bottom surface of the base. In some embodiments, the apparatus includes a suction pad operable to provide a non-contact vertical suction force.

Abstract: An optical device comprising a substrate with a front surface, a back surface and a circumferential side surface is described. At least one portion of an edge of the front surface has a texturization, wherein recesses of the texturization are filled with a light-absorbent material. The circumferential side surface is free of light-absorbent material.

Abstract: Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to apparatuses and methods for gripping optical devices. In an embodiment, an apparatus for gripping an optical device includes a base coupled to a proximal end of a stem extending from a bottom surface of the base. The apparatus also includes a plurality of arms movably coupled to the bottom surface of the base. The plurality of arms are coupled to an actuator operable to move the plurality of arms laterally along a X-Y plane parallel to the bottom surface of the base. In some embodiments, the apparatus includes a suction pad operable to provide a noncontact vertical suction force.

Abstract: A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.

Abstract: An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Abstract: A method for constructing an optical switch and the switch constructed thereby are described. An optical switch having a pair of chips is assembled with a plurality of optical fibers mounted on the chips such that endfaces of the fibers extend beyond ends of the chips. The optical fibers may be mounted by adhering them to the chips. The endfaces of the fibers and the front surfaces of the chips are then polished to provide coplanar surfaces which are good optical couplers. The chips are then etched with an etchant material which is ineffective at etching the optical fibers. The chips may include a coating which is resistant to the etchant material.

Abstract: An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.

Abstract: Methods for making a micromachined device (e.g. an microoptical submount) having positive features (extending up from a device surface) and negative features (extending into the device surface). The present techniques locate the postive feature and negative features according to a single mask step. In one embodiment, a hard mask is patterned on top of the device layer of an SOI wafer. Then, RIE is used to vertically etch to the etch stop layer, forming the positive feature. Then, the positive feature is masked, and metal or hard mask is deposited on the exposed areas of the etch stop layer. Then, portions of the device layer are removed, leaving the patterned metal layer on the etch stop layer. Then, the etch stop layer is removed in an exposed area, uncovering the handle layer. Then, the handle layer is etched in an exposed area to form the negative feature.

Abstract: A method of producing surface features in a substrate includes steps of forming a film having a composition that varies in the direction of its thickness on the substrate, forming a mask on the heterogeneous film, etching the film to thereby pattern the film, and etching the structure that includes the patterned film to erode the film and correspondingly shape the substrate as the film is so being eroded. In this way, the pattern of the film is transferred to the substrate in a manner dependent on the selectivity of one or both of the etching processes as well as the thickness of the discrete mask layers, or in the case of a continuously graded film, the “slope” of the stoichiometric change with respect to position in the overall thickness of the film.

Abstract: The invention includes an integrated optical device having an embedded waveguide and an alignment groove. The waveguide is made by depositing waveguide material in a trench and then planarizing the chip. The alignment grooves can provide passive alignment for connecting the chip to other waveguides or optical fibers.