Abstract: An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.

Abstract: An apparatus for removably retaining an IC package in engagement with a socket such that the contacts of both the IC package and the socket are properly engaged is disclosed. Specifically, a universal retention mechanism (URM) which may be fabricated in a diecast material, may comprise a retention frame to engage a socket. A load plate hinged to the retention frame may be caused to press the socket and IC package together through force selectively applied through the use of a load lever. In addition, the frame may contain features to attach a thermal solution (e.g. a heat sink or other cooling device) directly to the frame thus eliminating the need to attach it directly to a motherboard or through a backplate.

Abstract: Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the top of the bore in the support base of the heat sink, a spring adapted to bias the screw against the heat sink, wherein the screw and spring engage the standoff to attach the heat sink to the support base. The integrated heat sink assembly may be used to maintain contact between a heat sink and a processor on a motherboard. Other embodiments are disclosed and claimed.

Abstract: In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted spring has a plurality of holes each of which is aligned with a respective one of the holes in the circuit board.

Abstract: The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

Abstract: The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

Abstract: A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.

Abstract: A microprocessor heat sink retention module is described. That module comprises a first frame that has a first side and a second side. The first side is separated from the second side by a distance that is sufficient to enable a microprocessor to fit within the frame. The first and second sides each have at least one aperture for receiving a microprocessor heat sink. The module also has a heat transfer platform, which is integrated with the first frame. The heat transfer platform comprises a substantially flat metal slab for dissipating heat that is generated by a voltage regulator. Also described are an assembly for a computer and a computer system that include this microprocessor heat sink retention module.

Abstract: The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force nay be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.

Abstract: A heat sink retention module provides physical support for a heat sink while providing an electrical ground path for the heat sink. The retention module includes a ground strip that maintains an electrical contact with the heat sink while contacting a circuit board ground connection. In one embodiment, the ground strip includes upwardly extending spring members that contact the heat sink. In another embodiment, the ground strip includes a Faraday Cage formed from downwardly extending tabs. The retention module can be used in conjunction with an electrically conductive heat sink to provide a ground plane over an integrated circuit to shield the circuit from electromagnetic interference.

Abstract: An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.