Patents by Inventor Ned R. Saleh

Ned R. Saleh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9330985
    Abstract: Methods and systems are provided for fabricating and measuring features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves fabricating a feature of the semiconductor device structure on a wafer of semiconductor material, determining a hybrid recipe for measuring the feature, configuring a plurality of metrology tools to implement the hybrid recipe, and obtaining a hybrid measurement of the feature in accordance with the hybrid recipe.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: May 3, 2016
    Assignees: GLOBALFOUNDRIES, INC., INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Alok Vaid, Ned R. Saleh, Matthew J. Sendelbach, Narender N. Rana
  • Publication number: 20130245806
    Abstract: Methods and systems are provided for fabricating and measuring features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves fabricating a feature of the semiconductor device structure on a wafer of semiconductor material, determining a hybrid recipe for measuring the feature, configuring a plurality of metrology tools to implement the hybrid recipe; and obtaining a hybrid measurement of the feature in accordance with the hybrid recipe.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 19, 2013
    Applicants: International Business Machines Corporation, GLOBALFOUNDRIES INC.
    Inventors: Alok Vaid, Ned R. Saleh, Matthew J. Sendelbach, Narender N. Rana
  • Publication number: 20130203188
    Abstract: Methods and systems are provided for fabricating and measuring physical features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves forming a first feature of the semiconductor device structure on a substrate of semiconductor material, obtaining a first measurement for the semiconductor device structure from a first metrology tool, obtaining a second measurement of the first feature of the semiconductor device structure from a second metrology tool, and determining a hybrid measurement for the first feature based at least in part on the first measurement and the second measurement.
    Type: Application
    Filed: February 3, 2012
    Publication date: August 8, 2013
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Alok Vaid, Ned R. Saleh, Matthew J. Sendelbach, Narender Rana