Patents by Inventor Nee S. Ling

Nee S. Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CLAMPING ASSEMBLY
    Publication number: 20100096735
    Abstract: A clamping assembly for clamping a lead frame with pre-attached semiconductor device, comprising of: a first member, to hold the lead frame, said first member having a surface profile in contact with a surface profile of the semiconductor device, a second member for allowing the mounting of the first member thereon, an attachment means to secure the first member onto the second member, wherein the attachment means is adjustable to conform the surface profile of the first member to the surface profile of the lead frame.
    Type: Application
    Filed: November 16, 2007
    Publication date: April 22, 2010
    Applicant: ROKKO TECHNOLOGY PTE LTD.
    Inventors: Xue F. Shen, Jing Zhang, Nee S. Ling, Soo L. Ang