Patents by Inventor Nee Seng Ling

Nee Seng Ling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball Mounting Apparatus and Method
    Publication number: 20120031954
    Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder halls to the first plate.
    Type: Application
    Filed: October 14, 2011
    Publication date: February 9, 2012
    Applicant: ROKKO VENTURES PTE LTD
    Inventors: Nee Seng Ling, Soo Loo Ang, Ter Siang Pai
  • Ball mounting apparatus and method
    Patent number: 8061583
    Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.
    Type: Grant
    Filed: November 22, 2007
    Date of Patent: November 22, 2011
    Assignee: Rokko Ventures Pte Ltd
    Inventors: Nee Seng Ling, Soo Loo Ang, Ter Siang Pai
  • BALL MOUNTING APPARATUS AND METHOD
    Publication number: 20100051671
    Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.
    Type: Application
    Filed: November 22, 2007
    Publication date: March 4, 2010
    Inventors: Nee Seng Ling, Soo Loo Ang, Ter Siang Pai
  • Method and machine for underfilling an assembly to form a semiconductor package
    Patent number: 6225144
    Abstract: A method and machine (1) for underfilling an assembly (8) to form semiconductor package is disclosed. The machine (1) has conveying tracks (2) for continuously conveying the assembly (8) past zones. The assembly (8) has a flexible tape substrate (9) with a mounted inverted semiconductor die (10). The machine includes a preheating zone (3), a dispensing zone (4) for dispensing an underfill material onto the substrate (9) whilst heating the assembly (8) to allow the underfill to flow into a gap between the substrate (9) and semiconductor die (10). The machine (1) also has a postheating zone (5) for postheating the assembly (8) after dispensing to provide for a continuous flow of the underfill into the gap.
    Type: Grant
    Filed: January 19, 2000
    Date of Patent: May 1, 2001
    Assignee: Motorola, Inc.
    Inventors: James Boon Hua How, Han Yang Chua, Peter Zhihua Yuan, Nee Seng Ling