Abstract: The invention concerns a method for forming an electronic device in plastic. The method for forming an electronic device in plastic comprises: (a) placing electronic components (220, 215) in recesses (210, 215) in a thermoplastic substrate (200); (b) depositing (135) an electronic circuit (230) over the electronic components (220, 225), or onto a thermoplastic sheet (240); and (c) bonding (160) the thermoplastic substrate (200) with the thermoplastic sheet (240) in a thermal bonding process to seal the electronic components (220, 215) and the electronic circuit (230) between the thermoplastic substrate (200) and the thermoplastic sheet (240), wherein the method further comprises providing a thermally conductive layer (250) on the thermoplastic sheet (240) and/or substrate (200) such that heat applied during the thermal bonding process is distributed uniformly across the thermoplastic sheet (240) and/or substrate (200) to facilitate bonding of the thermoplastic sheet (240) and substrate (200).

Abstract: A method of forming electronic components in which a thermoplastic substrate is embossed to create a recess for electronic components; the electronic component is placed in the recess; electrical connections and circuitry are deposited over the components on the thermoplastic substrate; and a cover sheet of thermoplastic material is bonded over the circuitry. The process may also be carried out in reverse order. The apparatus used consists of a hot embossing machine having a former shaped for each particular circuit to be assembled; a pick and place machine with standard reel loading of components; and a screen printer for printing the conductive ink circuitry or a station for adhering conductive tape or preprinted film.