Patents by Inventor Neelkanth S. Gupte
Neelkanth S. Gupte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12163673Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.Type: GrantFiled: September 11, 2023Date of Patent: December 10, 2024Assignee: TYCO FIRE & SECURITY GMBHInventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
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Patent number: 12146681Abstract: A curb assembly for a heating, ventilation, and/or air conditioning (HVAC) system includes a frame configured to couple to a curb of a structure, a pedestal system configured to couple to a housing of the HVAC system and to the frame, such that the pedestal system extends from the housing to the frame, and an adjustable duct connector configured to fluidly couple an air flow passage of the housing with ductwork of the structure. The pedestal system is configured to enclose a space formed between the frame and the housing and the adjustable duct connector configured to be disposed within the space.Type: GrantFiled: August 14, 2023Date of Patent: November 19, 2024Assignee: TYCO FIRE & SECURITY GMBHInventors: Manjur Tamboli, Neelkanth S. Gupte, Sarjerao D. Pingale
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Patent number: 12098887Abstract: Embodiments of the present disclosure are directed to a heat exchanger system that includes a conduit configured to flow a working fluid therethrough, where the conduit has a first portion, a second portion, and a bend directly coupling the first portion and the second portion, where the first portion includes a first header connection, the second portion includes a second header connection, and the bend is distal to the first header connection and the second header connection and a support plate coupled to the bend and positioned between the first portion and the second portion of the conduit.Type: GrantFiled: September 16, 2021Date of Patent: September 24, 2024Assignee: TYCO FIRE & SECURITY GMBHInventors: Neelkanth S. Gupte, Zhiwei Huang, Curtis A. Trammell
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Publication number: 20230417427Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.Type: ApplicationFiled: September 11, 2023Publication date: December 28, 2023Inventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
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Patent number: 11852372Abstract: A heating, ventilation, and/or air conditioning (HVAC) system, includes a housing having a wall with an exterior surface configured to be exposed to an ambient environment. The HVAC system further includes a first heat exchanger disposed within the housing and forming part of a refrigerant circuit of the HVAC system and a second heat exchanger disposed within the housing and forming part of the refrigerant circuit, in which the second heat exchanger includes a coil coupled to the wall, such that the coil and the wall are configured to transfer heat between the ambient environment and refrigerant passing through the second heat exchanger.Type: GrantFiled: July 21, 2022Date of Patent: December 26, 2023Assignee: Johnson Controls Tyco IP Holdings LLPInventors: Anil V. Bhosale, Ketan S. Khedkar, Nikhil N. Naik, Hambirarao S. Sawant, Neelkanth S. Gupte
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Publication number: 20230383987Abstract: A curb assembly for a heating, ventilation, and/or air conditioning (HVAC) system includes a frame configured to couple to a curb of a structure, a pedestal system configured to couple to a housing of the HVAC system and to the frame, such that the pedestal system extends from the housing to the frame, and an adjustable duct connector configured to fluidly couple an air flow passage of the housing with ductwork of the structure. The pedestal system is configured to enclose a space formed between the frame and the housing and the adjustable duct connector configured to be disposed within the space.Type: ApplicationFiled: August 14, 2023Publication date: November 30, 2023Inventors: Manjur Tamboli, Neelkanth S. Gupte, Sarjerao D. Pingale
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Publication number: 20230349640Abstract: Embodiments of the present disclosure are directed to a climate management system that includes a heat exchanger having a first set of microchannel coils fluidly coupled to a first circuit of the climate management system and a second set of microchannel coils fluidly coupled to a second circuit of the climate management system, where the first circuit and the second circuit are fluidly separate from one another, and where the first set of microchannel coils and the second set of microchannel coils are disposed in an alternating arrangement along a length of the heat exchanger such that the first set of microchannel coils and the second set of microchannel coils are interlaced in the heat exchanger.Type: ApplicationFiled: March 27, 2023Publication date: November 2, 2023Inventors: Zhiwei Huang, Neelkanth S. Gupte
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Patent number: 11754298Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.Type: GrantFiled: September 13, 2021Date of Patent: September 12, 2023Assignee: Johnson Controls Tyco IP Holdings LLPInventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
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Patent number: 11725845Abstract: A curb assembly for a heating, ventilation, and/or air conditioning (HVAC) system includes a frame configured to couple to a curb of a structure, a pedestal system configured to couple to a housing of the HVAC system and to the frame, such that the pedestal system extends from the housing to the frame, and an adjustable duct connector configured to fluidly couple an air flow passage of the housing with ductwork of the structure. The pedestal system is configured to enclose a space formed between the frame and the housing and the adjustable duct connector configured to be disposed within the space.Type: GrantFiled: January 25, 2022Date of Patent: August 15, 2023Assignee: Johnson Controls Tyco IP Holdings LLPInventors: Manjur Tamboli, Neelkanth S. Gupte, Sarjerao D. Pingale
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Patent number: 11614285Abstract: Embodiments of the present disclosure are directed to a climate management system that includes a heat exchanger having a first set of microchannel coils fluidly coupled to a first circuit of the climate management system and a second set of microchannel coils fluidly coupled to a second circuit of the climate management system, where the first circuit and the second circuit are fluidly separate from one another, and where the first set of microchannel coils and the second set of microchannel coils are disposed in an alternating arrangement along a length of the heat exchanger such that the first set of microchannel coils and the second set of microchannel coils are interlaced in the heat exchanger.Type: GrantFiled: June 28, 2021Date of Patent: March 28, 2023Assignee: Johnson Controls Technology CompanyInventors: Zhiwei Huang, Neelkanth S. Gupte
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Patent number: 11549694Abstract: A heating, ventilation, and/or air conditioning (HVAC) unit includes a cabinet defining a cabinet interior configured to house components of the HVAC unit. The cabinet includes an opening defining an air flow path between the cabinet interior and an external environment. The HVAC unit also includes a fan assembly including fan blades configured to move an air flow through the opening, wherein the fan assembly is configured to enable translation of the fan blades through the opening between a shipping arrangement in which the fan blades are disposed in the cabinet interior and an operational arrangement in which the fan blades are disposed in the external environment.Type: GrantFiled: January 15, 2020Date of Patent: January 10, 2023Assignee: Johnson Controls Tyco IP Holdings LLPInventors: Marc Huynh, Neelkanth S. Gupte, Zhiwei Huang, Kirankumar A. Muley
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Publication number: 20220357056Abstract: A heating, ventilation, and/or air conditioning (HVAC) system, includes a housing having a wall with an exterior surface configured to be exposed to an ambient environment. The HVAC system further includes a first heat exchanger disposed within the housing and forming part of a refrigerant circuit of the HVAC system and a second heat exchanger disposed within the housing and forming part of the refrigerant circuit, in which the second heat exchanger includes a coil coupled to the wall, such that the coil and the wall are configured to transfer heat between the ambient environment and refrigerant passing through the second heat exchanger.Type: ApplicationFiled: July 21, 2022Publication date: November 10, 2022Inventors: Anil V. Bhosale, Ketan S. Khedkar, Nikhil N. Naik, Hambirarao S. Sawant, Neelkanth S. Gupte
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Patent number: 11397014Abstract: A heating, ventilation, and/or air conditioning (HVAC) system, includes a housing having a wall with an exterior surface configured to be exposed to an ambient environment. The HVAC system further includes a first heat exchanger disposed within the housing and forming part of a refrigerant circuit of the HVAC system and a second heat exchanger disposed within the housing and forming part of the refrigerant circuit, in which the second heat exchanger includes a coil coupled to the wall, such that the coil and the wall are configured to transfer heat between the ambient environment and refrigerant passing through the second heat exchanger.Type: GrantFiled: March 27, 2019Date of Patent: July 26, 2022Assignee: Johnson Controls Tyco IP Holdings LLPInventors: Anil V. Bhosale, Ketan S. Khedkar, Nikhil N. Naik, Hambirarao S. Sawant, Neelkanth S. Gupte
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Publication number: 20220146144Abstract: A curb assembly for a heating, ventilation, and/or air conditioning (HVAC) system includes a frame configured to couple to a curb of a structure, a pedestal system configured to couple to a housing of the HVAC system and to the frame, such that the pedestal system extends from the housing to the frame, and an adjustable duct connector configured to fluidly couple an air flow passage of the housing with ductwork of the structure. The pedestal system is configured to enclose a space formed between the frame and the housing and the adjustable duct connector configured to be disposed within the space.Type: ApplicationFiled: January 25, 2022Publication date: May 12, 2022Inventors: Manjur Tamboli, Neelkanth S. Gupte, Sarjerao D. Pingale
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Patent number: 11287166Abstract: Embodiments of the present disclosure relate to a condenser assembly for a heating, ventilation, and/or air conditioning (HVAC) system that includes a condenser coil having a plurality of tubes configured to flow a refrigerant therethrough for heat transfer between the refrigerant and a flow of air passing across the plurality of tubes, and a porous material having a plurality of fluid retaining passages, in which the plurality of fluid retaining passages is configured to receive a fluid and enable the flow of air to pass through the porous material and transfer of thermal energy to between the fluid and the flow of air. The porous material is disposed upstream of the condenser coil with respect to the flow of air such that the flow of air passes through the porous material before passing across the plurality of tubes.Type: GrantFiled: January 31, 2019Date of Patent: March 29, 2022Assignee: Johnson Controls Technology CompanyInventors: Mujibul R. Mohammad, Anil V. Bhosale, Baskaran K, Neelkanth S. Gupte
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Patent number: 11268722Abstract: The present disclosure relates to a heating, ventilation, and air conditioning (HVAC) system that includes an energy recovery conduit that is configured to extend between and fluidly couple an outlet of a central housing of an outdoor HVAC unit and a condenser section of the outdoor HVAC unit.Type: GrantFiled: April 11, 2018Date of Patent: March 8, 2022Assignee: Johnson Controls Technology CompanyInventors: Marcel P. Ferrere, Neelkanth S. Gupte, Rajiv K. Karkhanis
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Publication number: 20220065468Abstract: A heating, ventilation, and/or air conditioning (HVAC) packaged unit includes a first refrigerant circuit component configured to change a temperature or a pressure of a refrigerant flowing through the first refrigerant circuit component and a second refrigerant circuit component configured to change a temperature or a pressure of the refrigerant flowing through the second refrigerant circuit component. The first and the second refrigerant circuit components are within a common refrigerant circuit that is disposed within a common support structure. The HVAC packaged unit also includes an interconnection conduit having a length formed from aluminum, a first end segment coupled to a first end of the length, and a second end segment coupled to a second end of the length. The first end segment and the second end segment are each formed from copper, and the interconnection conduit extends between the first refrigerant circuit component and the second refrigerant circuit component.Type: ApplicationFiled: September 13, 2021Publication date: March 3, 2022Inventors: Sarjerao Pingale, Manjur Tamboli, Neelkanth S. Gupte, Anand Talikot, Baskaran Kandhappan
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Patent number: 11236928Abstract: A curb assembly for a heating, ventilation, and/or air conditioning (HVAC) system includes a frame configured to couple to a curb of a structure, a pedestal system configured to couple to a housing of the HVAC system and to the frame, such that the pedestal system extends from the housing to the frame, and an adjustable duct connector configured to fluidly couple an air flow passage of the housing with ductwork of the structure. The pedestal system is configured to enclose a space formed between the frame and the housing and the adjustable duct connector configured to be disposed within the space.Type: GrantFiled: June 14, 2019Date of Patent: February 1, 2022Assignee: Johnson Controls Technology CompanyInventors: Manjur Tamboli, Neelkanth S. Gupte, Sarjerao D. Pingale
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Publication number: 20220003504Abstract: Embodiments of the present disclosure are directed to a heat exchanger system that includes a conduit configured to flow a working fluid therethrough, where the conduit has a first portion, a second portion, and a bend directly coupling the first portion and the second portion, where the first portion includes a first header connection, the second portion includes a second header connection, and the bend is distal to the first header connection and the second header connection and a support plate coupled to the bend and positioned between the first portion and the second portion of the conduit.Type: ApplicationFiled: September 16, 2021Publication date: January 6, 2022Inventors: Neelkanth S. Gupte, Zhiwei Huang, Curtis A. Trammell
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Patent number: 11162706Abstract: The present disclosure relates to a heating, ventilation, and/or air conditioning (HVAC) system including an exhaust plenum configured to receive an exhaust air flow from a cooling load. The HVAC system also includes a condenser configured to receive an input air flow and transfer thermal energy to the input air flow. A panel is positioned directly adjacent to and between the exhaust plenum and the condenser. The panel includes a passage providing a fluid flow path directly between the exhaust plenum and the condenser. The passage is configured to discharge a portion of the exhaust air flow, and the input air flow includes the portion.Type: GrantFiled: September 19, 2018Date of Patent: November 2, 2021Assignee: Johnson Controls Technology CompanyInventors: Anil V. Bhosale, Appiya B. Suriya Prakash, Neelkanth S. Gupte, Vinay Nanjappa