Patents by Inventor Neeraj Kumar Reddy DANTU

Neeraj Kumar Reddy DANTU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Configurable substrate and systems
    Patent number: 11171126
    Abstract: Systems and devices for enabling the use of SIP subsystems to make a configurable system having a unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems such that desired characteristics and features for the configurable system are provided.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: November 9, 2021
    Assignee: OCTAVO SYSTEMS LLC
    Inventors: Masood Murtuza, Gene Alan Frantz, Neeraj Kumar Reddy Dantu
  • Method for routing bond wires in system in a package (SiP) devices
    Patent number: 11157676
    Abstract: Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: October 26, 2021
    Assignee: OCTAVO SYSTEMS LLC
    Inventors: Neeraj Kumar Reddy Dantu, Masood Murtuza, Gene Alan Frantz
  • METHOD FOR ROUTING BOND WIRES IN SYSTEM IN A PACKAGE (SIP) DEVICES
    Publication number: 20190347378
    Abstract: Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.
    Type: Application
    Filed: September 18, 2017
    Publication date: November 14, 2019
    Applicant: OCTAVO SYSTEMS LLC
    Inventors: Neeraj Kumar Reddy DANTU, Masood MURTUZA, Gene Alan FRANTZ
  • IMPROVED SYSTEM USING SYSTEM IN PACKAGE COMPONENTS
    Publication number: 20190074268
    Abstract: Methods, systems, and devices for enabling the use of SIP subsystems to make a configurable system with desired characteristics and features are provided. A configurable system's unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems.
    Type: Application
    Filed: September 2, 2016
    Publication date: March 7, 2019
    Applicant: Octavo Systems LLC
    Inventors: Masood MURTUZA, Gene Alan FRANTZ, Neeraj Kumar Reddy DANTU