Patents by Inventor Neethumol O.U.

Neethumol O.U. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ASSYMMETRICAL DATA RATES FOR HIGH SPEED INTERCONNECTS
    Publication number: 20240095206
    Abstract: Embodiments described herein may include apparatus, systems, techniques, or processes that are directed to semiconductor interconnects, such as on-package die-to-die (D2D) interconnects, for example. Specifically, embodiments herein may relate to on-package D2D interconnects for memory that use or relate to the Universal Chiplet Interconnect Express (UCIe) adapter or physical layer (PHY). Other embodiments are described and claimed.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Applicant: Intel Corporation
    Inventors: Sampath Dakshinamurthy, Pooja Jadhav, Neethumol O.U., Lakshmipriya Seshan