Patents by Inventor Neil C. Delaplane

Neil C. Delaplane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6191475
    Abstract: A substrate for reducing electromagnetic emissions is provided. The substrate may include a plurality of ground layers, signal layers and power layers. All of the layers other than the ground layer are provided with a ground ring that may extend around the perimeter of the layer. The ground rings are electrically coupled together by ground stitching or vias that are randomly spaced. The random spacing of the ground stitching is based on the operating frequencies of the integrated circuit devices mounted on the substrate. Additional shielding may be provided by providing a cover assembly made of any conductive material that is coupled to the exposed ground rings on the uppermost and lowermost surfaces of the substrate. The cover assembly is coupled to the exposed ground rings in a randomized pattern. The device provides a virtual electrical ground cage in which the internal signal layers are totally enclosed, thereby reducing electromagnetic emissions.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: February 20, 2001
    Assignee: Intel Corporation
    Inventors: Harry G. Skinner, Neil C. Delaplane, Ravi V. Mahajan, Robert Starkston, Mirng-ji Lii, Ron Edsall
  • Patent number: 6011696
    Abstract: An electronic cartridge comprising a cartridge substrate, a package substrate, an integrated circuit, and an enclosure. The package substrate is mounted to the cartridge substrate. The integrated circuit is mounted to the package substrate. The enclosure encloses the integrated circuit, the package substrate and the cartridge substrate.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: January 4, 2000
    Assignee: Intel Corporation
    Inventors: Ravi V. Mahajan, Hong Xie, Neil C. Delaplane, Gregory A. James
  • Patent number: 5568357
    Abstract: Impacts to the case of a portable electronic unit including a display are dissipated by a plurality of thermoplastic elastomeric damping elements which isolate an internal frame unit, carrying the display and associated electronic components, from contact with the enclosure. Each damping element is provided with corresponding positioning structures within the case to ensure that the frame unit "floats" on protective shock absorbing material to provide three-dimensional support and damping of impacts incident from any direction. Damping elements may take the form of small caps of elastomeric material at spaced positions around the periphery of the frame unit. Electronic connections to the display screen are accomplished using flexible connectors to maintain the mechanical isolation of the display screen from the rest of the unit.
    Type: Grant
    Filed: June 15, 1994
    Date of Patent: October 22, 1996
    Assignee: Metanetics Corporation
    Inventors: Gary Kochis, Neil C. Delaplane, William R. Rebh, James M. Cisar, Yung-Fu Chang
  • Patent number: D461180
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: August 6, 2002
    Assignee: Intel Corporation
    Inventors: Robert L. Van Egmond, Shawn S. McEuen, Gary L. Bookhardt, Marc A. Abrams, Neil C. Delaplane, Brad T. Combs, Josh Gordon, Ryan Wilday