Abstract: The present invention relates to a thermally insulated optical module. A heat source/sink is thermally coupled with an optical element for sourcing/sinking heat there to/from for temperature regulating the optical element. A thermally insulating packaging forms an enclosure surrounding the optical element. The thermally insulating packaging provides a thermally controlled environment within the enclosure. A thermally conductive structure is disposed within the enclosure and is thermally coupled to the heat source/sink for being temperature regulated thereby. The thermally conductive structure outlines a space surrounding the optical element for providing together with the heat source/sink a second thermally controlled environment therein. The second thermally controlled environment provides a lower temperature gradient across the optical element than absent the thermally conductive structure.