Patents by Inventor Neil Eggleston

Neil Eggleston has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation shielding of three dimensional multi-chip modules
    Patent number: 6858795
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: February 22, 2005
    Assignee: Maxwell Technologies, Inc.
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Radiation shielding of three dimensional multi-chip modules
    Publication number: 20040031618
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Application
    Filed: August 18, 2003
    Publication date: February 19, 2004
    Applicants: Maxwell Electronic Components Group, Inc., Space Electronics, Inc.
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Radiation shielding of three dimensional multi-chip modules
    Patent number: 6613978
    Abstract: A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Grant
    Filed: June 9, 2001
    Date of Patent: September 2, 2003
    Assignee: Maxwell Technologies, Inc.
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Radiation shielding of three dimensional multi-chip modules
    Publication number: 20020050371
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention to describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Application
    Filed: June 9, 2001
    Publication date: May 2, 2002
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Radiation shielding of three dimensional multi-chip modules
    Patent number: 6262362
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: July 17, 2001
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Radiation shielding of three dimensional multi-chip modules
    Patent number: 5880403
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: March 9, 1999
    Assignee: Space Electronics, Inc.
    Inventors: David Czajkowski, Neil Eggleston, Janet Patterson