Patents by Inventor Neil F. Damon

Neil F. Damon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4894031
    Abstract: An electronic socket carrier system in which a plurality of lead sockets are mounted on a thin flexible carrier strip which can be removed from the sockets after mounting on a circuit board. The lead sockets each include retention elements on the socket body to retain the socket on the carrier strip and which can also be employed for locking the socket into a mounting hole of a circuit board. The sockets are cold formed or machined to have a plurality of barbs each with a ramp surface to facilitate installation of the sockets into cooperative holes in the carrier strip, and an edge portion for retaining the socket once installed on the carrier strip.
    Type: Grant
    Filed: May 19, 1988
    Date of Patent: January 16, 1990
    Assignee: Augat Inc.
    Inventors: Neil F. Damon, Ronald E. Senor
  • Patent number: 4887981
    Abstract: An electronic socket carrier system in which a plurality of lead sockets are mounted on a thin flexible carrier strip which can be removed from the sockets after their mounting on a circuit board. The lead sockets each include retention elements on the socket body to retain the socket on the carrier strip and which can also be employed for locking the socket into a mounting hole of a circuit board. The sockets are preferably cold formed and have a plurality of barbs each with a ramp surface to facilitate installation of the sockets into cooperative holes in the carrier strip, and an edge portion for retaining the socket once installed on the carrier strip.
    Type: Grant
    Filed: November 25, 1987
    Date of Patent: December 19, 1989
    Assignee: Augat Inc.
    Inventors: Neil F. Damon, Ronald E. Senor
  • Patent number: 4508405
    Abstract: An electronic component socket for leadless or leaded electronic component packages in which the package is clamped within the socket and to which positive electrical contact is made by spring loaded probes. A body of electrically insulative material has an array of parallel passages extending therethrough in a pattern corresponding to the pattern of the electrical contact areas of an associated component to be retained in the socket. A spring probe assembly is included within each passage of the socket body and includes a lower conductive member retained in the passage and having a lead outwardly extending therefrom, and an upper conductive member slidable in the passage and coupled to the lower conductive member by a coil spring. For a leadless package, a contact probe outwardly extends from the upper conductive member and in its unloaded condition projects outwardly from the passage. The probes each includes a pointed tip for mating with the respective contact areas of the leadless package.
    Type: Grant
    Filed: April 29, 1982
    Date of Patent: April 2, 1985
    Assignee: Augat Inc.
    Inventors: Neil F. Damon, Frank C. Rydwansky, Jr.
  • Patent number: 4338717
    Abstract: A method for making a light emitting diode display socket. A standard receiving socket with contact terminals extending in a dual-in-line configuration from one side thereof is coupled to one edge of each of two printed circuit cards having individual terminals extending from another edge. The contact terminals of the socket enter appropriate holes along the one edge of the printed circuit cards. The assembly is then wave soldered to permanently connect the individual terminals and the socket contact terminals to the printed circuit cards. The cards are then folded toward each other to a parallel, spaced confronting position and they are secured in that position for final permanent assembly.
    Type: Grant
    Filed: September 2, 1980
    Date of Patent: July 13, 1982
    Assignee: Augat Inc.
    Inventor: Neil F. Damon
  • Patent number: 4175810
    Abstract: An electrical interconnection board with lead sockets mounted in plated-through holes therein. The lead sockets are hollow cylindrical elements having a tapered entry opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the plated-through holes in the board with the receptacle end of the socket opening into the component side of the board. The invention is also concerned with the method for mounting lead sockets to electrical interconnection boards.
    Type: Grant
    Filed: November 18, 1977
    Date of Patent: November 27, 1979
    Assignee: AUGAT Inc.
    Inventors: Richard C. Holt, Neil F. Damon, Richard J. Hanlon
  • Patent number: 4097101
    Abstract: An electrical interconnection board with lead sockets mounted in holes therein. The lead sockets are hollow cylindrical elements having a tapered opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the holes in the board with the receptacle end of the socket opening into the component side of the board. The invention is also concerned with the method for mounting lead sockets to electrical interconnection boards.
    Type: Grant
    Filed: November 22, 1976
    Date of Patent: June 27, 1978
    Assignee: Augat Inc.
    Inventors: Richard C. Holt, Neil F. Damon, Richard J. Hanlon
  • Patent number: 4030793
    Abstract: A dual-in-line programming jumper pin assembly for use with electrical panel boards having dual-in-line arrays of holes therethrough. Jumper pins may be mounted as desired in slots in an insulator having a shape and size similar to the body of a dual-in-line electronic package, for purposes of electrically interconnecting two or more socket contacts mounted in a panel board. Such jumper pins having different configurations may interconnect, among others: two or more adjacent socket contacts in a line; two socket contacts on opposite sides of an array; two adjacent socket contacts with a third on the opposite side of the array; and two adjacent socket contacts with two other adjacent ones on the opposite side of the array. Means are provided on each jumper pin to anchor it firmly within the slots in the insulator. The jumper pins may be employed for interconnecting two or more socket contacts independently of the insulator.
    Type: Grant
    Filed: June 30, 1975
    Date of Patent: June 21, 1977
    Assignee: Augat, Inc.
    Inventors: Richard J. Hanlon, Neil F. Damon, Herbert G. Yeo