Patents by Inventor Neil Kaplan

Neil Kaplan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulating moisture-proof coating
    Patent number: 4327369
    Abstract: A resin formulation, especially adapted for use in the encapsulating of electronic or electric devices, is provided. The formulation comprises a thermosettable resin composition to which has been added an effective amount of a trialkoxyorgano-metal silane compound. The formulation also preferably includes a solid filler material.
    Type: Grant
    Filed: August 25, 1980
    Date of Patent: April 27, 1982
    Assignee: Hi-Tech Industries, Inc.
    Inventor: Neil Kaplan
  • Thermosetting molding resin compositions
    Patent number: 4225554
    Abstract: This invention provides, in a first aspect, means for obtaining a liquid thermosetting polyester resin composition which is degassed without the loss of volatile component, by the presence of a dimethyl polysiloxane ingredient in the resin composition. The second aspect of the invention provides for mold lubrication and parting without substantial surface problems in the finished product by the presence of a mixture of an alkyl phosphate ester parting agent in combination with an alkylene bis-alkamide material.
    Type: Grant
    Filed: July 26, 1978
    Date of Patent: September 30, 1980
    Assignee: Hi-Tech Industries, Inc.
    Inventor: Neil Kaplan
  • Thermosetting molding resin compositions
    Patent number: 4129543
    Abstract: This invention provides, in a first aspect, means for obtaining a liquid thermosetting polyester resin composition which is degassed without the loss of volatile component, by the presence of a dimethyl polysiloxane ingredient in the resin composition. The second aspect of the invention provides for mold lubrication and parting without substantial surface problems in the finished product by the presence of a mixture of an alkyl phosphate ester parting agent in combination with an alkylene bis-alkamide material.
    Type: Grant
    Filed: June 18, 1976
    Date of Patent: December 12, 1978
    Assignee: Hi-Tech Industries, Inc.
    Inventor: Neil Kaplan