Patents by Inventor Neil Korpusik

Neil Korpusik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pin toggling using an object oriented programming language
    Patent number: 6698004
    Abstract: The present invention provides a solution for converting a boundary scan description language (BSDL) file to a hardware verification language (HVL) test program file. The BSDL file is scanned for header information and the header information is stored in a header object. The BSDL file is then scanned for pin information, the pin information corresponding to at least one pin in the BSDL file having a pin location, and stored in a pin object. At least one variable for the HVL test program file is created and bound to one of the pin locations resulting in a binding relationship for each variable. The binding relationships are then stored in a bind object. The present invention is designed to overcome the disadvantages of the prior art.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: February 24, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: Keshava I. Satish, Neil Korpusik
  • PIN TOGGLING USING AN OBJECT ORIENTED PROGRAMMING LANGUAGE
    Publication number: 20030237060
    Abstract: The present invention provides a solution for converting a boundary scan description language (BSDL) file to a hardware verification language (HVL) test program file. The BSDL file is scanned for header information and the header information is stored in a header object. The BSDL file is then scanned for pin information, the pin information corresponding to at least one pin in the BSDL file having a pin location, and stored in a pin object. At least one variable for the HVL test program file is created and bound to one of the pin locations resulting in a binding relationship for each variable. The binding relationships are then stored in a bind object. The present invention is designed to overcome the disadvantages of the prior art.
    Type: Application
    Filed: June 20, 2002
    Publication date: December 25, 2003
    Applicant: Sun Microsystems, Inc., a Delaware Corporation
    Inventors: Keshava I. Satish, Neil Korpusik